Wire Hook
The wire-bond pull test is the most universally accepted method used to verify the quality of the wire bonding process. Our precision micro machined tips
We achieved technical breakthrough in the field of complex ultrafine processes manufacturing know-how to produce the tweezer pull with tight tolerance and uncompromising performance results. Application for both solder bump and Wire Bond ball bond vertical pull.
The wire-bond pull test is the most universally accepted method used to verify the quality of the wire bonding process. Our precision micro machined tips
We achieved technical breakthrough in the field of complex ultrafine processes manufacturing know-how to produce the tweezer pull with tight tolerance and uncompromising performance results.
Ball Shear testing is used to assess the integrity of the gold ball-to-bonding pad interface in the gold ball bonding process. A shear tool moves
4JMSolutions (Malta) Ltd. was founded in 2008 on a solid base of international servicing and more than 25 years of high end industrial experience. Based on the solid principal of providing solutions where the equipment offered is a biproduct of the solution.
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