Wire Hook

The wire-bond pull test is the most universally accepted method used to verify the quality of the wire bonding process. Our precision micro machined tips are specially designed for narrow wire pitch of 50 microns and below. Special wire pull material for longer life span and better performance. We provide various type of hook to meet customers’ different bond tester such as DAGE, XYZ, Royce, Rhesca and etc.


Related Bond Testing Tools

Cold Bump Pull

We achieved technical breakthrough in the field of complex ultrafine processes manufacturing know-how to produce the tweezer pull with tight tolerance and uncompromising performance results.

Read More »

Ball / Die Shear

Ball Shear testing is used to assess the integrity of the gold ball-to-bonding pad interface in the gold ball bonding process. A shear tool moves

Read More »