{"id":14750,"date":"2022-09-25T08:22:01","date_gmt":"2022-09-25T08:22:01","guid":{"rendered":"https:\/\/newsite.com\/ausruestung-halbleiter-sensor-einzelne-komponenten-front-end\/die-bonders\/"},"modified":"2024-01-18T10:26:36","modified_gmt":"2024-01-18T10:26:36","slug":"die-bonder-maschinen","status":"publish","type":"page","link":"https:\/\/4jmsolutions.com\/de\/ausruestung\/halbleiter-sensor-einzelne-komponenten\/front-end\/die-bonder-maschinen\/","title":{"rendered":"Die-Bonder-Maschinen"},"content":{"rendered":"\t\t<div data-elementor-type=\"wp-page\" data-elementor-id=\"14750\" class=\"elementor elementor-14750\" data-elementor-post-type=\"page\">\n\t\t\t\t\t\t<section data-particle_enable=\"false\" data-particle-mobile-disabled=\"false\" class=\"elementor-section elementor-top-section elementor-element elementor-element-12042e46 elementor-section-stretched elementor-section-boxed elementor-section-height-default elementor-section-height-default\" data-id=\"12042e46\" data-element_type=\"section\" data-settings=\"{&quot;stretch_section&quot;:&quot;section-stretched&quot;,&quot;animation&quot;:&quot;none&quot;}\">\n\t\t\t\t\t\t<div class=\"elementor-container elementor-column-gap-default\">\n\t\t\t\t\t<div class=\"elementor-column elementor-col-50 elementor-top-column elementor-element elementor-element-4af4dbf5\" data-id=\"4af4dbf5\" data-element_type=\"column\">\n\t\t\t<div class=\"elementor-widget-wrap elementor-element-populated\">\n\t\t\t\t\t\t<div class=\"elementor-element elementor-element-47f86868 elementor-widget elementor-widget-text-editor\" data-id=\"47f86868\" data-element_type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t<style>\/*! elementor - v3.19.0 - 28-02-2024 *\/\n.elementor-widget-text-editor.elementor-drop-cap-view-stacked .elementor-drop-cap{background-color:#69727d;color:#fff}.elementor-widget-text-editor.elementor-drop-cap-view-framed .elementor-drop-cap{color:#69727d;border:3px solid;background-color:transparent}.elementor-widget-text-editor:not(.elementor-drop-cap-view-default) .elementor-drop-cap{margin-top:8px}.elementor-widget-text-editor:not(.elementor-drop-cap-view-default) .elementor-drop-cap-letter{width:1em;height:1em}.elementor-widget-text-editor .elementor-drop-cap{float:left;text-align:center;line-height:1;font-size:50px}.elementor-widget-text-editor .elementor-drop-cap-letter{display:inline-block}<\/style>\t\t\t\t<h5><span style=\"font-weight: 400;\"><img decoding=\"async\" class=\"alignnone wp-image-701\" src=\"https:\/\/4jmsolutions.com\/wp-content\/uploads\/2022\/09\/cropped-favicon-300x300.png\" alt=\"\" width=\"21\" height=\"21\" srcset=\"https:\/\/4jmsolutions.com\/wp-content\/uploads\/2022\/09\/cropped-favicon-300x300.png 300w, https:\/\/4jmsolutions.com\/wp-content\/uploads\/2022\/09\/cropped-favicon-150x150.png 150w, https:\/\/4jmsolutions.com\/wp-content\/uploads\/2022\/09\/cropped-favicon-50x50.png 50w, https:\/\/4jmsolutions.com\/wp-content\/uploads\/2022\/09\/cropped-favicon-100x100.png 100w, https:\/\/4jmsolutions.com\/wp-content\/uploads\/2022\/09\/cropped-favicon.png 512w, https:\/\/4jmsolutions.com\/wp-content\/uploads\/2022\/09\/cropped-favicon-270x270.png 270w, https:\/\/4jmsolutions.com\/wp-content\/uploads\/2022\/09\/cropped-favicon-192x192.png 192w, https:\/\/4jmsolutions.com\/wp-content\/uploads\/2022\/09\/cropped-favicon-180x180.png 180w, https:\/\/4jmsolutions.com\/wp-content\/uploads\/2022\/09\/cropped-favicon-32x32.png 32w\" sizes=\"(max-width: 21px) 100vw, 21px\" \/>4JMSolutions: Pionierleistungen mit fortschrittlichen Die-Bonder-Maschinen<\/span><\/h5><p>Das Die-Bonden, das oft als das Herzst\u00fcck des Halbleiter-Montageprozesses angesehen wird, findet seine wahre Innovation in den technologisch \u00fcberlegenen Maschinen von <span style=\"font-weight: 400;\"><img decoding=\"async\" class=\"alignnone wp-image-701\" src=\"https:\/\/4jmsolutions.com\/wp-content\/uploads\/2022\/09\/cropped-favicon-300x300.png\" alt=\"\" width=\"21\" height=\"21\" srcset=\"https:\/\/4jmsolutions.com\/wp-content\/uploads\/2022\/09\/cropped-favicon-300x300.png 300w, https:\/\/4jmsolutions.com\/wp-content\/uploads\/2022\/09\/cropped-favicon-150x150.png 150w, https:\/\/4jmsolutions.com\/wp-content\/uploads\/2022\/09\/cropped-favicon-50x50.png 50w, https:\/\/4jmsolutions.com\/wp-content\/uploads\/2022\/09\/cropped-favicon-100x100.png 100w, https:\/\/4jmsolutions.com\/wp-content\/uploads\/2022\/09\/cropped-favicon.png 512w, https:\/\/4jmsolutions.com\/wp-content\/uploads\/2022\/09\/cropped-favicon-270x270.png 270w, https:\/\/4jmsolutions.com\/wp-content\/uploads\/2022\/09\/cropped-favicon-192x192.png 192w, https:\/\/4jmsolutions.com\/wp-content\/uploads\/2022\/09\/cropped-favicon-180x180.png 180w, https:\/\/4jmsolutions.com\/wp-content\/uploads\/2022\/09\/cropped-favicon-32x32.png 32w\" sizes=\"(max-width: 21px) 100vw, 21px\" \/><\/span>4JMSolutions. Dieser entscheidende Die-Befestigungs-Prozess, bei dem ein Die\/Chip auf einem Substrat oder Leadframe angebracht wird, ist von zentraler Bedeutung f\u00fcr die Halbleiterfertigung. Mit dem unaufhaltsamen Tempo der Miniaturisierung und dem st\u00e4ndig wachsenden Bedarf an Pr\u00e4zision ist die Wahl der richtigen Die-Bonder-Maschine von entscheidender Bedeutung.<\/p><p><span style=\"text-decoration: underline;\"><span style=\"font-weight: 400;\"><img decoding=\"async\" class=\"alignnone wp-image-701\" src=\"https:\/\/4jmsolutions.com\/wp-content\/uploads\/2022\/09\/cropped-favicon-300x300.png\" alt=\"\" width=\"21\" height=\"21\" srcset=\"https:\/\/4jmsolutions.com\/wp-content\/uploads\/2022\/09\/cropped-favicon-300x300.png 300w, https:\/\/4jmsolutions.com\/wp-content\/uploads\/2022\/09\/cropped-favicon-150x150.png 150w, https:\/\/4jmsolutions.com\/wp-content\/uploads\/2022\/09\/cropped-favicon-50x50.png 50w, https:\/\/4jmsolutions.com\/wp-content\/uploads\/2022\/09\/cropped-favicon-100x100.png 100w, https:\/\/4jmsolutions.com\/wp-content\/uploads\/2022\/09\/cropped-favicon.png 512w, https:\/\/4jmsolutions.com\/wp-content\/uploads\/2022\/09\/cropped-favicon-270x270.png 270w, https:\/\/4jmsolutions.com\/wp-content\/uploads\/2022\/09\/cropped-favicon-192x192.png 192w, https:\/\/4jmsolutions.com\/wp-content\/uploads\/2022\/09\/cropped-favicon-180x180.png 180w, https:\/\/4jmsolutions.com\/wp-content\/uploads\/2022\/09\/cropped-favicon-32x32.png 32w\" sizes=\"(max-width: 21px) 100vw, 21px\" \/><\/span>4JMSolutions stellt die besten Die-Bonder-Maschinen vor:<\/span><\/p><h6><strong>FC-1210 Chip-auf-Substrat- oder Leadframe-Maschine<\/strong><\/h6><p>Die FC-1210 setzt neue Ma\u00dfst\u00e4be in Genauigkeit und Effizienz und ist f\u00fcr einen breiten Bereich von Chipgr\u00f6\u00dfen von 0,5 bis 6 mm mit einer erweiterten Option f\u00fcr 6 bis 20 mm ausgelegt. Mit einer beeindruckenden SUPH (Sorted Units Per Hour) von bis zu 5.500 ist ihre Pr\u00e4zision mit einer lokalen Genauigkeit von \u00b13\u00b5m und einer globalen Genauigkeit von \u00b15\u00b5m unbestreitbar. Die Besonderheit dieser Maschine ist die Integration eines Bondkraftsensors, der eine optimale Krafteinwirkung w\u00e4hrend des Die-Bonding-Prozesses von Halbleitern gew\u00e4hrleistet.<\/p><h6>FC-1250 Chip-auf-Substrat- oder Leadframe-Maschine<\/h6><p>Der FC-1250 ist ein wahrer Titan unter den Die-Bondern und wurde f\u00fcr Hochgeschwindigkeits-Operationen mit einer erstaunlichen SUPH von bis zu 15.000 entwickelt. Diese Maschine ist f\u00fcr Die-Gr\u00f6\u00dfen von 0,3 x 8 mm geeignet und steht f\u00fcr Vielseitigkeit und Pr\u00e4zision. Sie verf\u00fcgt \u00fcber einen BH-Kraftbereich von 0,5 bis 10 N, der eine schonendes, aber dennoch festes Bonding gew\u00e4hrleistet. Die Genauigkeit der Maschine liegt bei \u00b110\u00b5m und sie bietet verschiedene Bonding-Verfahren: Face-Down-Dipping und eine Kombination aus Face-Up\/Face-Down mit BH\/Chunk-Tischheizung und Dipping.<\/p>\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t<div class=\"elementor-column elementor-col-50 elementor-top-column elementor-element elementor-element-5e994e9e\" data-id=\"5e994e9e\" data-element_type=\"column\">\n\t\t\t<div class=\"elementor-widget-wrap elementor-element-populated\">\n\t\t\t\t\t\t<div class=\"elementor-element elementor-element-d34e9ab elementor-widget elementor-widget-image-gallery\" data-id=\"d34e9ab\" data-element_type=\"widget\" data-widget_type=\"image-gallery.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t<style>\/*! elementor - v3.19.0 - 28-02-2024 *\/\n.elementor-image-gallery .gallery-item{display:inline-block;text-align:center;vertical-align:top;width:100%;max-width:100%;margin:0 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class=\"elementor-post elementor-grid-item post-15508 page type-page status-publish has-post-thumbnail hentry\">\n\t\t\t\t<a class=\"elementor-post__thumbnail__link\" href=\"https:\/\/4jmsolutions.com\/de\/ausruestung\/halbleiter-sensor-einzelne-komponenten\/front-end\/die-bonder-maschinen\/fc-1250-chip-zu-substrate-oder-fuhrungsrahmen\/\" tabindex=\"-1\" >\n\t\t\t<div class=\"elementor-post__thumbnail\"><img decoding=\"async\" width=\"635\" height=\"463\" src=\"https:\/\/4jmsolutions.com\/wp-content\/uploads\/2022\/11\/fc-1250-chip-to-substrate-or-leadframe-thumbnail.png\" class=\"attachment-full size-full wp-image-13400\" alt=\"\" srcset=\"https:\/\/4jmsolutions.com\/wp-content\/uploads\/2022\/11\/fc-1250-chip-to-substrate-or-leadframe-thumbnail.png 635w, https:\/\/4jmsolutions.com\/wp-content\/uploads\/2022\/11\/fc-1250-chip-to-substrate-or-leadframe-thumbnail-300x219.png 300w\" sizes=\"(max-width: 635px) 100vw, 635px\" \/><\/div>\n\t\t<\/a>\n\t\t\t\t<div class=\"elementor-post__text\">\n\t\t\t\t<h3 class=\"elementor-post__title\">\n\t\t\t<a href=\"https:\/\/4jmsolutions.com\/de\/ausruestung\/halbleiter-sensor-einzelne-komponenten\/front-end\/die-bonder-maschinen\/fc-1250-chip-zu-substrate-oder-fuhrungsrahmen\/\" >\n\t\t\t\tFC-1250 Chip zu Substrate oder F\u00fchrungsrahmen\t\t\t<\/a>\n\t\t<\/h3>\n\t\t\t\t<div class=\"elementor-post__excerpt\">\n\t\t\t<p>FC-1250 Chip zu Substrate oder F\u00fchrungsrahmen SUPH bis zu 15,000 Die-Gr\u00f6\u00dfe 0.3x8mm BH-Kraft 0.5-10N Genauigkeit \u00b110\u00b5m Face-down; Eintauchen Weitere Informationen Anfordern Verwandte Die-Bonder-Maschinen<\/p>\n\t\t<\/div>\n\t\t\t\t\t<div class=\"elementor-post__read-more-wrapper\">\n\t\t\n\t\t<a class=\"elementor-post__read-more\" href=\"https:\/\/4jmsolutions.com\/de\/ausruestung\/halbleiter-sensor-einzelne-komponenten\/front-end\/die-bonder-maschinen\/fc-1250-chip-zu-substrate-oder-fuhrungsrahmen\/\" aria-label=\"Read more about FC-1250 Chip zu Substrate oder F\u00fchrungsrahmen\" tabindex=\"-1\" >\n\t\t\tRead More \u00bb\t\t<\/a>\n\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/article>\n\t\t\t\t<article class=\"elementor-post elementor-grid-item post-15496 page type-page status-publish has-post-thumbnail hentry\">\n\t\t\t\t<a class=\"elementor-post__thumbnail__link\" href=\"https:\/\/4jmsolutions.com\/de\/ausruestung\/halbleiter-sensor-einzelne-komponenten\/front-end\/die-bonder-maschinen\/fc-1210-chip-zu-substrate-oder-fuhrungsrahmen\/\" tabindex=\"-1\" >\n\t\t\t<div class=\"elementor-post__thumbnail\"><img loading=\"lazy\" decoding=\"async\" width=\"635\" height=\"463\" src=\"https:\/\/4jmsolutions.com\/wp-content\/uploads\/2022\/11\/die-bonding-1-thumbnail.png\" class=\"attachment-full size-full wp-image-13398\" alt=\"\" srcset=\"https:\/\/4jmsolutions.com\/wp-content\/uploads\/2022\/11\/die-bonding-1-thumbnail.png 635w, https:\/\/4jmsolutions.com\/wp-content\/uploads\/2022\/11\/die-bonding-1-thumbnail-300x219.png 300w\" sizes=\"(max-width: 635px) 100vw, 635px\" \/><\/div>\n\t\t<\/a>\n\t\t\t\t<div class=\"elementor-post__text\">\n\t\t\t\t<h3 class=\"elementor-post__title\">\n\t\t\t<a href=\"https:\/\/4jmsolutions.com\/de\/ausruestung\/halbleiter-sensor-einzelne-komponenten\/front-end\/die-bonder-maschinen\/fc-1210-chip-zu-substrate-oder-fuhrungsrahmen\/\" >\n\t\t\t\tFC-1210 Chip zu Substrate oder F\u00fchrungsrahmen\t\t\t<\/a>\n\t\t<\/h3>\n\t\t\t\t<div class=\"elementor-post__excerpt\">\n\t\t\t<p>FC-1210 Chip zu Substrate oder F\u00fchrungsrahmen SUPH bis zu 5.500 Matrizengr\u00f6\u00dfe 0,5-6mm (6-20mm optional) Bondkraft-Sensor Genauigkeit \u00b13\u00b5m lokal \u00b15\u00b5m global Face-up\/Face-down; BH\/Chunk Tischheizung; Eintauchen Weitere<\/p>\n\t\t<\/div>\n\t\t\t\t\t<div class=\"elementor-post__read-more-wrapper\">\n\t\t\n\t\t<a class=\"elementor-post__read-more\" href=\"https:\/\/4jmsolutions.com\/de\/ausruestung\/halbleiter-sensor-einzelne-komponenten\/front-end\/die-bonder-maschinen\/fc-1210-chip-zu-substrate-oder-fuhrungsrahmen\/\" aria-label=\"Read more about FC-1210 Chip zu Substrate oder F\u00fchrungsrahmen\" tabindex=\"-1\" >\n\t\t\tRead More \u00bb\t\t<\/a>\n\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/article>\n\t\t\t\t<\/div>\n\t\t\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t<section data-particle_enable=\"false\" data-particle-mobile-disabled=\"false\" class=\"elementor-section elementor-top-section elementor-element elementor-element-3087dfdb elementor-section-stretched elementor-section-boxed elementor-section-height-default elementor-section-height-default elementor-invisible\" data-id=\"3087dfdb\" data-element_type=\"section\" data-settings=\"{&quot;stretch_section&quot;:&quot;section-stretched&quot;,&quot;animation&quot;:&quot;fadeIn&quot;}\">\n\t\t\t\t\t\t<div class=\"elementor-container elementor-column-gap-default\">\n\t\t\t\t\t<div class=\"elementor-column elementor-col-100 elementor-top-column elementor-element elementor-element-42f2e0c7\" data-id=\"42f2e0c7\" data-element_type=\"column\">\n\t\t\t<div class=\"elementor-widget-wrap elementor-element-populated\">\n\t\t\t\t\t\t<div class=\"elementor-element elementor-element-3f9968d4 elementor-widget-divider--view-line_text elementor-widget-divider--element-align-center elementor-widget elementor-widget-divider\" data-id=\"3f9968d4\" data-element_type=\"widget\" data-widget_type=\"divider.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<div class=\"elementor-divider\">\n\t\t\t<span class=\"elementor-divider-separator\">\n\t\t\t\t\t\t\t<h3 class=\"elementor-divider__text elementor-divider__element\">\n\t\t\t\tVerwandte Front End Produkte\t\t\t\t<\/h3>\n\t\t\t\t\t\t<\/span>\n\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-702e23bf elementor-posts--thumbnail-none elementor-grid-3 elementor-grid-tablet-2 elementor-grid-mobile-1 elementor-card-shadow-yes elementor-posts__hover-gradient elementor-widget elementor-widget-posts\" data-id=\"702e23bf\" data-element_type=\"widget\" data-settings=\"{&quot;cards_columns&quot;:&quot;3&quot;,&quot;cards_columns_tablet&quot;:&quot;2&quot;,&quot;cards_columns_mobile&quot;:&quot;1&quot;,&quot;cards_row_gap&quot;:{&quot;unit&quot;:&quot;px&quot;,&quot;size&quot;:35,&quot;sizes&quot;:[]},&quot;cards_row_gap_tablet&quot;:{&quot;unit&quot;:&quot;px&quot;,&quot;size&quot;:&quot;&quot;,&quot;sizes&quot;:[]},&quot;cards_row_gap_mobile&quot;:{&quot;unit&quot;:&quot;px&quot;,&quot;size&quot;:&quot;&quot;,&quot;sizes&quot;:[]}}\" data-widget_type=\"posts.cards\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<div class=\"elementor-posts-container elementor-posts elementor-posts--skin-cards elementor-grid\">\n\t\t\t\t<article class=\"elementor-post elementor-grid-item post-14761 page type-page status-publish has-post-thumbnail hentry\">\n\t\t\t<div class=\"elementor-post__card\">\n\t\t\t\t<div class=\"elementor-post__text\">\n\t\t\t\t<h3 class=\"elementor-post__title\">\n\t\t\t<a href=\"https:\/\/4jmsolutions.com\/de\/ausruestung\/halbleiter-sensor-einzelne-komponenten\/front-end\/flip-chip\/\" >\n\t\t\t\tFlip Chip\t\t\t<\/a>\n\t\t<\/h3>\n\t\t\t\t<div class=\"elementor-post__excerpt\">\n\t\t\t<p>Der Vorreiter der Flip-Chip-Bonding-Technologie Die transformative Welle der Miniaturisierung und verbesserten Konnektivit\u00e4t in der Welt der Halbleiter wird ma\u00dfgeblich durch bahnbrechende Technologien wie das Flip-Chip-Bonding<\/p>\n\t\t<\/div>\n\t\t\t\t\t<div class=\"elementor-post__read-more-wrapper\">\n\t\t\n\t\t<a class=\"elementor-post__read-more\" href=\"https:\/\/4jmsolutions.com\/de\/ausruestung\/halbleiter-sensor-einzelne-komponenten\/front-end\/flip-chip\/\" aria-label=\"Read more about Flip Chip\" tabindex=\"-1\" >\n\t\t\tRead More \u00bb\t\t<\/a>\n\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/article>\n\t\t\t\t<article class=\"elementor-post elementor-grid-item post-14750 page type-page status-publish has-post-thumbnail hentry\">\n\t\t\t<div class=\"elementor-post__card\">\n\t\t\t\t<div class=\"elementor-post__text\">\n\t\t\t\t<h3 class=\"elementor-post__title\">\n\t\t\t<a href=\"https:\/\/4jmsolutions.com\/de\/ausruestung\/halbleiter-sensor-einzelne-komponenten\/front-end\/die-bonder-maschinen\/\" >\n\t\t\t\tDie-Bonder-Maschinen\t\t\t<\/a>\n\t\t<\/h3>\n\t\t\t\t<div class=\"elementor-post__excerpt\">\n\t\t\t<p>4JMSolutions: Pionierleistungen mit fortschrittlichen Die-Bonder-Maschinen Das Die-Bonden, das oft als das Herzst\u00fcck des Halbleiter-Montageprozesses angesehen wird, findet seine wahre Innovation in den technologisch \u00fcberlegenen Maschinen<\/p>\n\t\t<\/div>\n\t\t\t\t\t<div class=\"elementor-post__read-more-wrapper\">\n\t\t\n\t\t<a class=\"elementor-post__read-more\" href=\"https:\/\/4jmsolutions.com\/de\/ausruestung\/halbleiter-sensor-einzelne-komponenten\/front-end\/die-bonder-maschinen\/\" aria-label=\"Read more about Die-Bonder-Maschinen\" tabindex=\"-1\" >\n\t\t\tRead More \u00bb\t\t<\/a>\n\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/article>\n\t\t\t\t<article class=\"elementor-post elementor-grid-item post-14739 page type-page status-publish has-post-thumbnail hentry\">\n\t\t\t<div class=\"elementor-post__card\">\n\t\t\t\t<div class=\"elementor-post__text\">\n\t\t\t\t<h3 class=\"elementor-post__title\">\n\t\t\t<a href=\"https:\/\/4jmsolutions.com\/de\/ausruestung\/halbleiter-sensor-einzelne-komponenten\/front-end\/die-sorter-mit-aoi\/\" >\n\t\t\t\tDie Sortier-Maschinen mit AOI\t\t\t<\/a>\n\t\t<\/h3>\n\t\t\t\t<div class=\"elementor-post__excerpt\">\n\t\t\t<p>Die Sortier-Maschine 4JMSolutions ist stolz auf seine hochmodernen Die-Sortier-Maschinen, die vollst\u00e4ndig in AOI-Systeme (Automated Optical Inspection) integriert sind. Das Sortieren von Chips ist seit langem<\/p>\n\t\t<\/div>\n\t\t\t\t\t<div class=\"elementor-post__read-more-wrapper\">\n\t\t\n\t\t<a class=\"elementor-post__read-more\" href=\"https:\/\/4jmsolutions.com\/de\/ausruestung\/halbleiter-sensor-einzelne-komponenten\/front-end\/die-sorter-mit-aoi\/\" aria-label=\"Read more about Die Sortier-Maschinen mit AOI\" tabindex=\"-1\" >\n\t\t\tRead More \u00bb\t\t<\/a>\n\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/article>\n\t\t\t\t<article class=\"elementor-post elementor-grid-item post-14710 page type-page status-publish has-post-thumbnail hentry\">\n\t\t\t<div class=\"elementor-post__card\">\n\t\t\t\t<div class=\"elementor-post__text\">\n\t\t\t\t<h3 class=\"elementor-post__title\">\n\t\t\t<a href=\"https:\/\/4jmsolutions.com\/de\/ausruestung\/halbleiter-sensor-einzelne-komponenten\/front-end\/wafer-aoi-systeme\/\" >\n\t\t\t\tWafer-AOI-Systeme\t\t\t<\/a>\n\t\t<\/h3>\n\t\t\t\t<div class=\"elementor-post__excerpt\">\n\t\t\t<p>4JMSolutions ist stolz darauf, fortschrittliche automatisierte optische Inspektionssysteme (AOI) f\u00fcr Wafer f\u00fchrender Hersteller anzubieten. Diese Systeme spielen eine entscheidende Rolle im Halbleiterfertigungsprozess, indem sie eine<\/p>\n\t\t<\/div>\n\t\t\t\t\t<div class=\"elementor-post__read-more-wrapper\">\n\t\t\n\t\t<a class=\"elementor-post__read-more\" href=\"https:\/\/4jmsolutions.com\/de\/ausruestung\/halbleiter-sensor-einzelne-komponenten\/front-end\/wafer-aoi-systeme\/\" aria-label=\"Read more about Wafer-AOI-Systeme\" tabindex=\"-1\" >\n\t\t\tRead More \u00bb\t\t<\/a>\n\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/article>\n\t\t\t\t<article class=\"elementor-post elementor-grid-item post-14657 page type-page status-publish has-post-thumbnail hentry\">\n\t\t\t<div class=\"elementor-post__card\">\n\t\t\t\t<div class=\"elementor-post__text\">\n\t\t\t\t<h3 class=\"elementor-post__title\">\n\t\t\t<a href=\"https:\/\/4jmsolutions.com\/de\/ausruestung\/halbleiter-sensor-einzelne-komponenten\/front-end\/wafer-level-burn-in\/\" >\n\t\t\t\tWafer Level Burn in\t\t\t<\/a>\n\t\t<\/h3>\n\t\t\t\t<div class=\"elementor-post__excerpt\">\n\t\t\t<p>Das Trooper-BI Wafer-Level VCSEL\/LED\/Micro LED Burn-in Wafer-Level-Testsystem ist \u00e4u\u00dferst vielseitig und kann eine gro\u00dfe Anzahl von Einheiten aufnehmen, bis zu 7.200 auf einmal. Die Maschine<\/p>\n\t\t<\/div>\n\t\t\t\t\t<div class=\"elementor-post__read-more-wrapper\">\n\t\t\n\t\t<a class=\"elementor-post__read-more\" href=\"https:\/\/4jmsolutions.com\/de\/ausruestung\/halbleiter-sensor-einzelne-komponenten\/front-end\/wafer-level-burn-in\/\" aria-label=\"Read more about Wafer Level Burn in\" tabindex=\"-1\" >\n\t\t\tRead More \u00bb\t\t<\/a>\n\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/article>\n\t\t\t\t<article class=\"elementor-post elementor-grid-item post-14637 page type-page status-publish has-post-thumbnail hentry\">\n\t\t\t<div class=\"elementor-post__card\">\n\t\t\t\t<div class=\"elementor-post__text\">\n\t\t\t\t<h3 class=\"elementor-post__title\">\n\t\t\t<a href=\"https:\/\/4jmsolutions.com\/de\/ausruestung\/halbleiter-sensor-einzelne-komponenten\/front-end\/ausruestung-halbleiter-sensor-einzelne-komponenten-front-end-laser-app-systeme\/\" >\n\t\t\t\tLaser-App-Systeme\t\t\t<\/a>\n\t\t<\/h3>\n\t\t\t\t<div class=\"elementor-post__excerpt\">\n\t\t\t<p>Unsere Laseranwendungssysteme f\u00fcr die Halbleiterfertigung bieten eine breite Auswahl an L\u00f6sungen f\u00fcr das Schneiden und Trennen von Wafern, einschlie\u00dflich laserbasierter Methoden, die eine pr\u00e4zise und<\/p>\n\t\t<\/div>\n\t\t\t\t\t<div class=\"elementor-post__read-more-wrapper\">\n\t\t\n\t\t<a class=\"elementor-post__read-more\" href=\"https:\/\/4jmsolutions.com\/de\/ausruestung\/halbleiter-sensor-einzelne-komponenten\/front-end\/ausruestung-halbleiter-sensor-einzelne-komponenten-front-end-laser-app-systeme\/\" aria-label=\"Read more about Laser-App-Systeme\" tabindex=\"-1\" >\n\t\t\tRead More \u00bb\t\t<\/a>\n\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/article>\n\t\t\t\t<\/div>\n\t\t\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t<\/div>\n\t\t","protected":false},"excerpt":{"rendered":"<p>4JMSolutions: Pionierleistungen mit fortschrittlichen Die-Bonder-Maschinen Das Die-Bonden, das oft als das Herzst\u00fcck des Halbleiter-Montageprozesses angesehen wird, findet seine wahre Innovation in den technologisch \u00fcberlegenen Maschinen von 4JMSolutions. Dieser entscheidende Die-Befestigungs-Prozess, bei dem ein Die\/Chip auf einem Substrat oder Leadframe angebracht wird, ist von zentraler Bedeutung f\u00fcr die Halbleiterfertigung. Mit dem unaufhaltsamen Tempo der Miniaturisierung und [&hellip;]<\/p>\n","protected":false},"author":1,"featured_media":13408,"parent":14650,"menu_order":153,"comment_status":"closed","ping_status":"closed","template":"","meta":{"footnotes":""},"industry":[],"maincategory":[],"package":[],"process-features":[],"sub-category":[],"acf":[],"yoast_head":"<!-- This site is optimized with the Yoast SEO Premium plugin v20.5 (Yoast SEO v22.1) - https:\/\/yoast.com\/wordpress\/plugins\/seo\/ -->\n<title>Die Bonder f\u00fcr die Verbindung von Chip und\/oder Die mit dem Substrat oder Leadframe<\/title>\n<meta name=\"description\" content=\"We supports our customers through providing solutions also for Die Bonding though our Chip and\/or Die to Substrate or Leadframe bonding.\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" 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