4JMSolutions carry a wide range of test probes (both cantilever & blade) commonly use in the die-sort and wafer mapping process. Our specially designed equipment and proprietary processes enable us to produce ultra fine probes with tight tolerance specification to ensure effective and long lasting applications. Tips radius down to six(6) microns can be maintained.
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Handy Redress Tool is a wire correction pen which helps you to improve on your wire bonding yield and output productivity. Request More Information Related
The Shaker Array Solder Paste Thawing and Mixing machine utilizes the high efficient ‘Trapezoidal’ tumbling concept that provide effective agitation to the contents. This patented
4JMSolutions (Malta) Ltd. was founded in 2008 on a solid base of international servicing and more than 25 years of high end industrial experience. Based on the solid principal of providing solutions where the equipment offered is a biproduct of the solution.
