{"id":14744,"date":"2022-09-25T08:22:01","date_gmt":"2022-09-25T08:22:01","guid":{"rendered":"https:\/\/newsite.com\/equipement-semiconducteur-composants-discrets-des-capteurs-front-end\/die-bonders\/"},"modified":"2024-01-18T10:07:27","modified_gmt":"2024-01-18T10:07:27","slug":"machines-die-bonders","status":"publish","type":"page","link":"https:\/\/4jmsolutions.com\/fr\/equipement\/semiconducteur-detection-composants-discrets\/front-end\/machines-die-bonders\/","title":{"rendered":"Machines Die Bonders"},"content":{"rendered":"\t\t<div data-elementor-type=\"wp-page\" data-elementor-id=\"14744\" class=\"elementor elementor-14744\" data-elementor-post-type=\"page\">\n\t\t\t\t\t\t<section data-particle_enable=\"false\" data-particle-mobile-disabled=\"false\" class=\"elementor-section elementor-top-section elementor-element elementor-element-12042e46 elementor-section-stretched elementor-section-boxed elementor-section-height-default elementor-section-height-default\" data-id=\"12042e46\" data-element_type=\"section\" data-settings=\"{&quot;stretch_section&quot;:&quot;section-stretched&quot;,&quot;animation&quot;:&quot;none&quot;}\">\n\t\t\t\t\t\t<div class=\"elementor-container elementor-column-gap-default\">\n\t\t\t\t\t<div class=\"elementor-column elementor-col-50 elementor-top-column elementor-element elementor-element-4af4dbf5\" data-id=\"4af4dbf5\" data-element_type=\"column\">\n\t\t\t<div class=\"elementor-widget-wrap elementor-element-populated\">\n\t\t\t\t\t\t<div class=\"elementor-element elementor-element-47f86868 elementor-widget elementor-widget-text-editor\" data-id=\"47f86868\" data-element_type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t<style>\/*! elementor - v3.19.0 - 28-02-2024 *\/\n.elementor-widget-text-editor.elementor-drop-cap-view-stacked .elementor-drop-cap{background-color:#69727d;color:#fff}.elementor-widget-text-editor.elementor-drop-cap-view-framed .elementor-drop-cap{color:#69727d;border:3px solid;background-color:transparent}.elementor-widget-text-editor:not(.elementor-drop-cap-view-default) .elementor-drop-cap{margin-top:8px}.elementor-widget-text-editor:not(.elementor-drop-cap-view-default) .elementor-drop-cap-letter{width:1em;height:1em}.elementor-widget-text-editor .elementor-drop-cap{float:left;text-align:center;line-height:1;font-size:50px}.elementor-widget-text-editor .elementor-drop-cap-letter{display:inline-block}<\/style>\t\t\t\t<h5><span style=\"font-weight: 400;\"><img decoding=\"async\" class=\"alignnone wp-image-701\" src=\"https:\/\/4jmsolutions.com\/wp-content\/uploads\/2022\/09\/cropped-favicon-300x300.png\" alt=\"\" width=\"21\" height=\"21\" srcset=\"https:\/\/4jmsolutions.com\/wp-content\/uploads\/2022\/09\/cropped-favicon-300x300.png 300w, https:\/\/4jmsolutions.com\/wp-content\/uploads\/2022\/09\/cropped-favicon-150x150.png 150w, https:\/\/4jmsolutions.com\/wp-content\/uploads\/2022\/09\/cropped-favicon-50x50.png 50w, https:\/\/4jmsolutions.com\/wp-content\/uploads\/2022\/09\/cropped-favicon-100x100.png 100w, https:\/\/4jmsolutions.com\/wp-content\/uploads\/2022\/09\/cropped-favicon.png 512w, https:\/\/4jmsolutions.com\/wp-content\/uploads\/2022\/09\/cropped-favicon-270x270.png 270w, https:\/\/4jmsolutions.com\/wp-content\/uploads\/2022\/09\/cropped-favicon-192x192.png 192w, https:\/\/4jmsolutions.com\/wp-content\/uploads\/2022\/09\/cropped-favicon-180x180.png 180w, https:\/\/4jmsolutions.com\/wp-content\/uploads\/2022\/09\/cropped-favicon-32x32.png 32w\" sizes=\"(max-width: 21px) 100vw, 21px\" \/>4JMSolutions : Pionnier de l&rsquo;excellence avec des machines avanc\u00e9es de die bonder<\/span><\/h5><p>La technique de die bonding , consid\u00e9r\u00e9e comme le pivot central du processus d&rsquo;assemblage des semi-conducteurs, tire son innovation des machines technologiquement avanc\u00e9es propos\u00e9es par <span style=\"font-weight: 400;\"><img decoding=\"async\" class=\"alignnone wp-image-701\" src=\"https:\/\/4jmsolutions.com\/wp-content\/uploads\/2022\/09\/cropped-favicon-300x300.png\" alt=\"\" width=\"21\" height=\"21\" srcset=\"https:\/\/4jmsolutions.com\/wp-content\/uploads\/2022\/09\/cropped-favicon-300x300.png 300w, https:\/\/4jmsolutions.com\/wp-content\/uploads\/2022\/09\/cropped-favicon-150x150.png 150w, https:\/\/4jmsolutions.com\/wp-content\/uploads\/2022\/09\/cropped-favicon-50x50.png 50w, https:\/\/4jmsolutions.com\/wp-content\/uploads\/2022\/09\/cropped-favicon-100x100.png 100w, https:\/\/4jmsolutions.com\/wp-content\/uploads\/2022\/09\/cropped-favicon.png 512w, https:\/\/4jmsolutions.com\/wp-content\/uploads\/2022\/09\/cropped-favicon-270x270.png 270w, https:\/\/4jmsolutions.com\/wp-content\/uploads\/2022\/09\/cropped-favicon-192x192.png 192w, https:\/\/4jmsolutions.com\/wp-content\/uploads\/2022\/09\/cropped-favicon-180x180.png 180w, https:\/\/4jmsolutions.com\/wp-content\/uploads\/2022\/09\/cropped-favicon-32x32.png 32w\" sizes=\"(max-width: 21px) 100vw, 21px\" \/><\/span>4JMSolutions. Ce proc\u00e9d\u00e9 capital qui consiste \u00e0 fixer une puce sur un substrat ou un leadframe est indispensable pour la production des semi-conducteurs. Avec l&rsquo;acc\u00e9l\u00e9ration constante du ph\u00e9nom\u00e8ne de miniaturisation et l&rsquo;exigence croissante en termes de pr\u00e9cision, il devient imp\u00e9ratif de s\u00e9lectionner avec soin la machine ad\u00e9quate pour coller les puces.<\/p><p><span style=\"text-decoration: underline;\">Voici les premi\u00e8res machines Die Bonder de <span style=\"font-weight: 400;\"><img decoding=\"async\" class=\"alignnone wp-image-701\" src=\"https:\/\/4jmsolutions.com\/wp-content\/uploads\/2022\/09\/cropped-favicon-300x300.png\" alt=\"\" width=\"21\" height=\"21\" srcset=\"https:\/\/4jmsolutions.com\/wp-content\/uploads\/2022\/09\/cropped-favicon-300x300.png 300w, https:\/\/4jmsolutions.com\/wp-content\/uploads\/2022\/09\/cropped-favicon-150x150.png 150w, https:\/\/4jmsolutions.com\/wp-content\/uploads\/2022\/09\/cropped-favicon-50x50.png 50w, https:\/\/4jmsolutions.com\/wp-content\/uploads\/2022\/09\/cropped-favicon-100x100.png 100w, https:\/\/4jmsolutions.com\/wp-content\/uploads\/2022\/09\/cropped-favicon.png 512w, https:\/\/4jmsolutions.com\/wp-content\/uploads\/2022\/09\/cropped-favicon-270x270.png 270w, https:\/\/4jmsolutions.com\/wp-content\/uploads\/2022\/09\/cropped-favicon-192x192.png 192w, https:\/\/4jmsolutions.com\/wp-content\/uploads\/2022\/09\/cropped-favicon-180x180.png 180w, https:\/\/4jmsolutions.com\/wp-content\/uploads\/2022\/09\/cropped-favicon-32x32.png 32w\" sizes=\"(max-width: 21px) 100vw, 21px\" \/><\/span><\/span><span style=\"text-decoration: underline;\">4JMSolutions:<\/span><\/p><h6><strong>Machine FC-1210 pour la fixation de puces sur des substrats ou des leadframes<\/strong><\/h6><p>Red\u00e9finissant la pr\u00e9cision et l&rsquo;efficacit\u00e9, la FC-1210 est con\u00e7ue pour traiter une large gamme de tailles de Die de 0,5 \u00e0 6 mm, avec une option \u00e9tendue pour 6 \u00e0 20 mm. Dot\u00e9e d&rsquo;une impressionnante capacit\u00e9 SUPH (Unit\u00e9s tri\u00e9es par heure) pouvant atteindre 5 500 unit\u00e9s, sa pr\u00e9cision est ind\u00e9niable avec une pr\u00e9cision locale de \u00b13\u00b5m et une pr\u00e9cision globale de \u00b15\u00b5m. Cette machine se distingue par l&rsquo;int\u00e9gration d&rsquo;un capteur de force de collage, qui garantit une application optimale de la force pendant le processus de collage des semi-conducteurs.<\/p><h6>Machine FC-1250 pour la fixation des puces sur des substrats ou des leadframes<\/h6><p>V\u00e9ritable titan dans la gamme des machines Die Bonder , la FC-1250 est con\u00e7ue pour les op\u00e9rations \u00e0 grande vitesse avec un SUPH stup\u00e9fiant allant jusqu&rsquo;\u00e0 15 000. Cette machine, qui peut traiter des Die de 0,3 x 8 mm, est synonyme de polyvalence et de pr\u00e9cision. Elle int\u00e8gre une force BH de 0,5 \u00e0 10 N, garantissant un collage doux mais ferme. La pr\u00e9cision de la machine est de \u00b110\u00b5m et elle offre diverses techniques de collage : trempage face vers le bas et combinaison face vers le haut\/face vers le bas avec chauffage de la table BH\/Chunk et trempage.<\/p>\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t<div class=\"elementor-column elementor-col-50 elementor-top-column elementor-element elementor-element-5e994e9e\" data-id=\"5e994e9e\" data-element_type=\"column\">\n\t\t\t<div class=\"elementor-widget-wrap elementor-element-populated\">\n\t\t\t\t\t\t<div class=\"elementor-element elementor-element-d34e9ab elementor-widget elementor-widget-image-gallery\" data-id=\"d34e9ab\" data-element_type=\"widget\" data-widget_type=\"image-gallery.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t<style>\/*! elementor - v3.19.0 - 28-02-2024 *\/\n.elementor-image-gallery 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100%;-webkit-mask-repeat:var(--divider-pattern-repeat);mask-repeat:var(--divider-pattern-repeat);background-color:var(--divider-color);-webkit-mask-image:var(--divider-pattern-url);mask-image:var(--divider-pattern-url)}.elementor-widget-divider--no-spacing{--divider-pattern-size:auto}.elementor-widget-divider--bg-round{--divider-pattern-repeat:round}.rtl .elementor-widget-divider .elementor-divider__text{direction:rtl}.e-con-inner>.elementor-widget-divider,.e-con>.elementor-widget-divider{width:var(--container-widget-width,100%);--flex-grow:var(--container-widget-flex-grow)}<\/style>\t\t<div class=\"elementor-divider\">\n\t\t\t<span class=\"elementor-divider-separator\">\n\t\t\t\t\t\t\t<h3 class=\"elementor-divider__text elementor-divider__element\">\n\t\t\t\tcertaines de nos machines de Die Bonders\t\t\t\t<\/h3>\n\t\t\t\t\t\t<\/span>\n\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-2dbb66a6 elementor-grid-3 elementor-grid-tablet-2 elementor-grid-mobile-1 elementor-posts--thumbnail-top elementor-widget elementor-widget-posts\" data-id=\"2dbb66a6\" data-element_type=\"widget\" data-settings=\"{&quot;classic_columns&quot;:&quot;3&quot;,&quot;classic_columns_tablet&quot;:&quot;2&quot;,&quot;classic_columns_mobile&quot;:&quot;1&quot;,&quot;classic_row_gap&quot;:{&quot;unit&quot;:&quot;px&quot;,&quot;size&quot;:35,&quot;sizes&quot;:[]},&quot;classic_row_gap_tablet&quot;:{&quot;unit&quot;:&quot;px&quot;,&quot;size&quot;:&quot;&quot;,&quot;sizes&quot;:[]},&quot;classic_row_gap_mobile&quot;:{&quot;unit&quot;:&quot;px&quot;,&quot;size&quot;:&quot;&quot;,&quot;sizes&quot;:[]}}\" data-widget_type=\"posts.classic\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t<link rel=\"stylesheet\" href=\"http:\/\/4jmsolutions.com\/wp-content\/plugins\/elementor-pro\/assets\/css\/widget-posts.min.css\">\t\t<div class=\"elementor-posts-container elementor-posts elementor-posts--skin-classic elementor-grid\">\n\t\t\t\t<article class=\"elementor-post elementor-grid-item post-15507 page type-page status-publish has-post-thumbnail hentry\">\n\t\t\t\t<a class=\"elementor-post__thumbnail__link\" href=\"https:\/\/4jmsolutions.com\/fr\/equipement\/semiconducteur-detection-composants-discrets\/front-end\/machines-die-bonders\/puce-fc-1250-vers-substrat-ou-leadframe\/\" tabindex=\"-1\" >\n\t\t\t<div class=\"elementor-post__thumbnail\"><img decoding=\"async\" width=\"635\" height=\"463\" src=\"https:\/\/4jmsolutions.com\/wp-content\/uploads\/2022\/11\/fc-1250-chip-to-substrate-or-leadframe-thumbnail.png\" class=\"attachment-full size-full wp-image-13399\" alt=\"\" srcset=\"https:\/\/4jmsolutions.com\/wp-content\/uploads\/2022\/11\/fc-1250-chip-to-substrate-or-leadframe-thumbnail.png 635w, https:\/\/4jmsolutions.com\/wp-content\/uploads\/2022\/11\/fc-1250-chip-to-substrate-or-leadframe-thumbnail-300x219.png 300w\" sizes=\"(max-width: 635px) 100vw, 635px\" \/><\/div>\n\t\t<\/a>\n\t\t\t\t<div class=\"elementor-post__text\">\n\t\t\t\t<h3 class=\"elementor-post__title\">\n\t\t\t<a href=\"https:\/\/4jmsolutions.com\/fr\/equipement\/semiconducteur-detection-composants-discrets\/front-end\/machines-die-bonders\/puce-fc-1250-vers-substrat-ou-leadframe\/\" >\n\t\t\t\tPuce FC-1250 Vers Substrat Ou Leadframe\t\t\t<\/a>\n\t\t<\/h3>\n\t\t\t\t<div class=\"elementor-post__excerpt\">\n\t\t\t<p>Puce FC-1250 Vers Substrat Ou Leadframe SUPH jusqu&rsquo;\u00e0 15 000 Taille du die 0.3x8mm Force BH 0.5-10N Pr\u00e9cision \u00b110\u00b5m Face vers le bas ; trempage<\/p>\n\t\t<\/div>\n\t\t\t\t\t<div class=\"elementor-post__read-more-wrapper\">\n\t\t\n\t\t<a class=\"elementor-post__read-more\" href=\"https:\/\/4jmsolutions.com\/fr\/equipement\/semiconducteur-detection-composants-discrets\/front-end\/machines-die-bonders\/puce-fc-1250-vers-substrat-ou-leadframe\/\" aria-label=\"Read more about Puce FC-1250 Vers Substrat Ou Leadframe\" tabindex=\"-1\" >\n\t\t\tRead More \u00bb\t\t<\/a>\n\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/article>\n\t\t\t\t<article class=\"elementor-post elementor-grid-item post-15495 page type-page status-publish has-post-thumbnail hentry\">\n\t\t\t\t<a class=\"elementor-post__thumbnail__link\" href=\"https:\/\/4jmsolutions.com\/fr\/equipement\/semiconducteur-detection-composants-discrets\/front-end\/machines-die-bonders\/puce-fc-1210-vers-substrat-ou-leadframe\/\" tabindex=\"-1\" >\n\t\t\t<div class=\"elementor-post__thumbnail\"><img loading=\"lazy\" decoding=\"async\" width=\"635\" height=\"463\" src=\"https:\/\/4jmsolutions.com\/wp-content\/uploads\/2022\/11\/die-bonding-1-thumbnail.png\" class=\"attachment-full size-full wp-image-13397\" alt=\"\" srcset=\"https:\/\/4jmsolutions.com\/wp-content\/uploads\/2022\/11\/die-bonding-1-thumbnail.png 635w, https:\/\/4jmsolutions.com\/wp-content\/uploads\/2022\/11\/die-bonding-1-thumbnail-300x219.png 300w\" sizes=\"(max-width: 635px) 100vw, 635px\" \/><\/div>\n\t\t<\/a>\n\t\t\t\t<div class=\"elementor-post__text\">\n\t\t\t\t<h3 class=\"elementor-post__title\">\n\t\t\t<a href=\"https:\/\/4jmsolutions.com\/fr\/equipement\/semiconducteur-detection-composants-discrets\/front-end\/machines-die-bonders\/puce-fc-1210-vers-substrat-ou-leadframe\/\" >\n\t\t\t\tPuce FC-1210 Vers Substrat Ou Leadframe\t\t\t<\/a>\n\t\t<\/h3>\n\t\t\t\t<div class=\"elementor-post__excerpt\">\n\t\t\t<p>Puce FC-1210 Vers Substrat Ou Leadframe SUPH jusqu&rsquo;\u00e0 5 500 Taille du die 0.5-6mm (option 6-20mm) Capteur de force de collage Pr\u00e9cision \u00b13\u00b5m locale \u00b15\u00b5m<\/p>\n\t\t<\/div>\n\t\t\t\t\t<div class=\"elementor-post__read-more-wrapper\">\n\t\t\n\t\t<a class=\"elementor-post__read-more\" href=\"https:\/\/4jmsolutions.com\/fr\/equipement\/semiconducteur-detection-composants-discrets\/front-end\/machines-die-bonders\/puce-fc-1210-vers-substrat-ou-leadframe\/\" aria-label=\"Read more about Puce FC-1210 Vers Substrat Ou Leadframe\" tabindex=\"-1\" >\n\t\t\tRead More \u00bb\t\t<\/a>\n\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/article>\n\t\t\t\t<\/div>\n\t\t\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t<section data-particle_enable=\"false\" data-particle-mobile-disabled=\"false\" class=\"elementor-section elementor-top-section elementor-element elementor-element-3087dfdb elementor-section-stretched elementor-section-boxed elementor-section-height-default elementor-section-height-default elementor-invisible\" data-id=\"3087dfdb\" data-element_type=\"section\" data-settings=\"{&quot;stretch_section&quot;:&quot;section-stretched&quot;,&quot;animation&quot;:&quot;fadeIn&quot;}\">\n\t\t\t\t\t\t<div class=\"elementor-container elementor-column-gap-default\">\n\t\t\t\t\t<div class=\"elementor-column elementor-col-100 elementor-top-column elementor-element elementor-element-42f2e0c7\" data-id=\"42f2e0c7\" data-element_type=\"column\">\n\t\t\t<div class=\"elementor-widget-wrap elementor-element-populated\">\n\t\t\t\t\t\t<div class=\"elementor-element elementor-element-3f9968d4 elementor-widget-divider--view-line_text elementor-widget-divider--element-align-center elementor-widget elementor-widget-divider\" data-id=\"3f9968d4\" data-element_type=\"widget\" data-widget_type=\"divider.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<div class=\"elementor-divider\">\n\t\t\t<span class=\"elementor-divider-separator\">\n\t\t\t\t\t\t\t<h3 class=\"elementor-divider__text elementor-divider__element\">\n\t\t\t\tproduits de front end associ\u00e9s\t\t\t\t<\/h3>\n\t\t\t\t\t\t<\/span>\n\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-702e23bf elementor-posts--thumbnail-none elementor-grid-3 elementor-grid-tablet-2 elementor-grid-mobile-1 elementor-card-shadow-yes elementor-posts__hover-gradient elementor-widget elementor-widget-posts\" data-id=\"702e23bf\" data-element_type=\"widget\" data-settings=\"{&quot;cards_columns&quot;:&quot;3&quot;,&quot;cards_columns_tablet&quot;:&quot;2&quot;,&quot;cards_columns_mobile&quot;:&quot;1&quot;,&quot;cards_row_gap&quot;:{&quot;unit&quot;:&quot;px&quot;,&quot;size&quot;:35,&quot;sizes&quot;:[]},&quot;cards_row_gap_tablet&quot;:{&quot;unit&quot;:&quot;px&quot;,&quot;size&quot;:&quot;&quot;,&quot;sizes&quot;:[]},&quot;cards_row_gap_mobile&quot;:{&quot;unit&quot;:&quot;px&quot;,&quot;size&quot;:&quot;&quot;,&quot;sizes&quot;:[]}}\" data-widget_type=\"posts.cards\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<div class=\"elementor-posts-container elementor-posts elementor-posts--skin-cards elementor-grid\">\n\t\t\t\t<article class=\"elementor-post elementor-grid-item post-14756 page type-page status-publish has-post-thumbnail hentry\">\n\t\t\t<div class=\"elementor-post__card\">\n\t\t\t\t<div class=\"elementor-post__text\">\n\t\t\t\t<h3 class=\"elementor-post__title\">\n\t\t\t<a href=\"https:\/\/4jmsolutions.com\/fr\/equipement\/semiconducteur-detection-composants-discrets\/front-end\/flip-chip\/\" >\n\t\t\t\tFlip Chip\t\t\t<\/a>\n\t\t<\/h3>\n\t\t\t\t<div class=\"elementor-post__excerpt\">\n\t\t\t<p>L&rsquo;avant-garde de la technologie de flip chip bonding La vague de transformation de la miniaturisation et de l&rsquo;am\u00e9lioration de la connectivit\u00e9 dans le monde des<\/p>\n\t\t<\/div>\n\t\t\t\t\t<div class=\"elementor-post__read-more-wrapper\">\n\t\t\n\t\t<a class=\"elementor-post__read-more\" href=\"https:\/\/4jmsolutions.com\/fr\/equipement\/semiconducteur-detection-composants-discrets\/front-end\/flip-chip\/\" aria-label=\"Read more about Flip Chip\" tabindex=\"-1\" >\n\t\t\tRead More \u00bb\t\t<\/a>\n\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/article>\n\t\t\t\t<article class=\"elementor-post elementor-grid-item post-14744 page type-page status-publish has-post-thumbnail hentry\">\n\t\t\t<div class=\"elementor-post__card\">\n\t\t\t\t<div class=\"elementor-post__text\">\n\t\t\t\t<h3 class=\"elementor-post__title\">\n\t\t\t<a href=\"https:\/\/4jmsolutions.com\/fr\/equipement\/semiconducteur-detection-composants-discrets\/front-end\/machines-die-bonders\/\" >\n\t\t\t\tMachines Die Bonders\t\t\t<\/a>\n\t\t<\/h3>\n\t\t\t\t<div class=\"elementor-post__excerpt\">\n\t\t\t<p>4JMSolutions : Pionnier de l&rsquo;excellence avec des machines avanc\u00e9es de die bonder La technique de die bonding , consid\u00e9r\u00e9e comme le pivot central du processus<\/p>\n\t\t<\/div>\n\t\t\t\t\t<div class=\"elementor-post__read-more-wrapper\">\n\t\t\n\t\t<a class=\"elementor-post__read-more\" href=\"https:\/\/4jmsolutions.com\/fr\/equipement\/semiconducteur-detection-composants-discrets\/front-end\/machines-die-bonders\/\" aria-label=\"Read more about Machines Die Bonders\" tabindex=\"-1\" >\n\t\t\tRead More \u00bb\t\t<\/a>\n\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/article>\n\t\t\t\t<article class=\"elementor-post elementor-grid-item post-14731 page type-page status-publish has-post-thumbnail hentry\">\n\t\t\t<div class=\"elementor-post__card\">\n\t\t\t\t<div class=\"elementor-post__text\">\n\t\t\t\t<h3 class=\"elementor-post__title\">\n\t\t\t<a href=\"https:\/\/4jmsolutions.com\/fr\/equipement\/semiconducteur-detection-composants-discrets\/front-end\/machine-a-trier-des-dies\/\" >\n\t\t\t\tMachine \u00e0 trier des dies\t\t\t<\/a>\n\t\t<\/h3>\n\t\t\t\t<div class=\"elementor-post__excerpt\">\n\t\t\t<p>Les trieurs de dies 4JMSolutions est fi\u00e8re de sa gamme sophistiqu\u00e9e de trieurs de dies , qui sont int\u00e9gr\u00e9s \u00e0 des syst\u00e8mes d&rsquo;inspection optique automatis\u00e9e<\/p>\n\t\t<\/div>\n\t\t\t\t\t<div class=\"elementor-post__read-more-wrapper\">\n\t\t\n\t\t<a class=\"elementor-post__read-more\" href=\"https:\/\/4jmsolutions.com\/fr\/equipement\/semiconducteur-detection-composants-discrets\/front-end\/machine-a-trier-des-dies\/\" aria-label=\"Read more about Machine \u00e0 trier des dies\" tabindex=\"-1\" >\n\t\t\tRead More \u00bb\t\t<\/a>\n\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/article>\n\t\t\t\t<article class=\"elementor-post elementor-grid-item post-14705 page type-page status-publish has-post-thumbnail hentry\">\n\t\t\t<div class=\"elementor-post__card\">\n\t\t\t\t<div class=\"elementor-post__text\">\n\t\t\t\t<h3 class=\"elementor-post__title\">\n\t\t\t<a href=\"https:\/\/4jmsolutions.com\/fr\/equipement\/semiconducteur-detection-composants-discrets\/front-end\/systemes-avances-aoi-des-wafers\/\" >\n\t\t\t\tSyst\u00e8mes Avanc\u00e9s AOI des wafers\t\t\t<\/a>\n\t\t<\/h3>\n\t\t\t\t<div class=\"elementor-post__excerpt\">\n\t\t\t<p>4JMSolutions a le plaisir de proposer des syst\u00e8mes avanc\u00e9s d&rsquo;Inspection Optique Automatique (AOI) des wafers en provenance des plus grands fabricants. Ces syst\u00e8mes jouent un<\/p>\n\t\t<\/div>\n\t\t\t\t\t<div class=\"elementor-post__read-more-wrapper\">\n\t\t\n\t\t<a class=\"elementor-post__read-more\" href=\"https:\/\/4jmsolutions.com\/fr\/equipement\/semiconducteur-detection-composants-discrets\/front-end\/systemes-avances-aoi-des-wafers\/\" aria-label=\"Read more about Syst\u00e8mes Avanc\u00e9s AOI des wafers\" tabindex=\"-1\" >\n\t\t\tRead More \u00bb\t\t<\/a>\n\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/article>\n\t\t\t\t<article class=\"elementor-post elementor-grid-item post-14656 page type-page status-publish has-post-thumbnail hentry\">\n\t\t\t<div class=\"elementor-post__card\">\n\t\t\t\t<div class=\"elementor-post__text\">\n\t\t\t\t<h3 class=\"elementor-post__title\">\n\t\t\t<a href=\"https:\/\/4jmsolutions.com\/fr\/equipement\/semiconducteur-detection-composants-discrets\/front-end\/niveau-de-deverminage-de-plaquette\/\" >\n\t\t\t\tWafer Level Burn in\t\t\t<\/a>\n\t\t<\/h3>\n\t\t\t\t<div class=\"elementor-post__excerpt\">\n\t\t\t<p>Le syst\u00e8me Trooper-BI Wafer-Leve VCSEL\/LED\/Micro LED test de Burn-in wafer level est tr\u00e8s polyvalent et peut accueillir un large \u00e9ventail d&rsquo;unit\u00e9s, jusqu&rsquo;\u00e0 7 200 en<\/p>\n\t\t<\/div>\n\t\t\t\t\t<div class=\"elementor-post__read-more-wrapper\">\n\t\t\n\t\t<a class=\"elementor-post__read-more\" href=\"https:\/\/4jmsolutions.com\/fr\/equipement\/semiconducteur-detection-composants-discrets\/front-end\/niveau-de-deverminage-de-plaquette\/\" aria-label=\"Read more about Wafer Level Burn in\" tabindex=\"-1\" >\n\t\t\tRead More \u00bb\t\t<\/a>\n\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/article>\n\t\t\t\t<article class=\"elementor-post elementor-grid-item post-14632 page type-page status-publish has-post-thumbnail hentry\">\n\t\t\t<div class=\"elementor-post__card\">\n\t\t\t\t<div class=\"elementor-post__text\">\n\t\t\t\t<h3 class=\"elementor-post__title\">\n\t\t\t<a href=\"https:\/\/4jmsolutions.com\/fr\/equipement\/semiconducteur-detection-composants-discrets\/front-end\/equipement-semiconducteur-capteur-discret-composants-avant-poste-systemes-dapplication-laser\/\" >\n\t\t\t\tSyst\u00e8mes d&rsquo;application laser\t\t\t<\/a>\n\t\t<\/h3>\n\t\t\t\t<div class=\"elementor-post__excerpt\">\n\t\t\t<p>Nos syst\u00e8mes d&rsquo;application laser pour la fabrication de semi-conducteurs offrent une gamme de solutions de d\u00e9coupe de wafer , y compris des m\u00e9thodes bas\u00e9es sur<\/p>\n\t\t<\/div>\n\t\t\t\t\t<div class=\"elementor-post__read-more-wrapper\">\n\t\t\n\t\t<a class=\"elementor-post__read-more\" href=\"https:\/\/4jmsolutions.com\/fr\/equipement\/semiconducteur-detection-composants-discrets\/front-end\/equipement-semiconducteur-capteur-discret-composants-avant-poste-systemes-dapplication-laser\/\" aria-label=\"Read more about Syst\u00e8mes d&rsquo;application laser\" tabindex=\"-1\" >\n\t\t\tRead More \u00bb\t\t<\/a>\n\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/article>\n\t\t\t\t<\/div>\n\t\t\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t<\/div>\n\t\t","protected":false},"excerpt":{"rendered":"<p>4JMSolutions : Pionnier de l&rsquo;excellence avec des machines avanc\u00e9es de die bonder La technique de die bonding , consid\u00e9r\u00e9e comme le pivot central du processus d&rsquo;assemblage des semi-conducteurs, tire son innovation des machines technologiquement avanc\u00e9es propos\u00e9es par 4JMSolutions. Ce proc\u00e9d\u00e9 capital qui consiste \u00e0 fixer une puce sur un substrat ou un leadframe est indispensable [&hellip;]<\/p>\n","protected":false},"author":1,"featured_media":13407,"parent":14645,"menu_order":153,"comment_status":"closed","ping_status":"closed","template":"","meta":{"footnotes":""},"industry":[],"maincategory":[],"package":[],"process-features":[],"sub-category":[],"acf":[],"yoast_head":"<!-- This site is optimized with the Yoast SEO Premium plugin v20.5 (Yoast SEO v22.1) - https:\/\/yoast.com\/wordpress\/plugins\/seo\/ -->\n<title>Fixateurs pour le collage de puces et\/ou de matrices sur des substrats ou des leadframes<\/title>\n<meta name=\"description\" content=\"We supports our customers through providing solutions also for Die Bonding though our Chip and\/or Die to Substrate or Leadframe bonding.\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" 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