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Electronic Flame Off (EFO)

Electronic flame off is used in the wire bonding process where high quality wire bonding is of utmost important. Our microprecision design and manufacture a wide range of EFO wands that is used currently in most wire bonder models in the semiconductor industry. These includes K&S, ASM, Kaijo, Shinkawa etc. Our company seeks high precision machining and use IRIDIUM materials to extend the life of ignition level and to ensure uniformity and stability in the process.

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Wedge

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Capillary Unplugging Wire

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Capillary Cleaning

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