In the evolving domain of semiconductor assembly, the essence of precision, speed, and reliability is paramount. 4JMSolutions, with its exemplary arsenal of semiconductor packaging equipment, solidifies its stance as the industry frontrunner.
4JMSolutions’ Active Alignment Assembly is a masterpiece in optical assembly. Combining high precision glue dispensing with top-notch vision technologies, the machine can seamlessly assemble and align various optical modules. The utilization of UV light ensures curing times are less than a second, optimizing production times.
Fully automating the IGBT assembling process, this machine blends high precision epoxy dispensing with a swift screw tightening process, ensuring efficiency and accuracy.
At the heart of 4JMSolutions lies innovation. Recognizing the dynamic needs of the industry, they offer bespoke solutions, working closely with world-class suppliers. This approach not only fosters innovation but ensures adaptability and customization, keeping 4JMSolutions at the apex of the semiconductor packaging and assembly landscape.
A specialist in micro SD card laser cutting, this machine ensures up to 4,500 accurately cut cards per hour. With options for single or dual beam lasers and post-cut vision inspection, it redefines precision.