4jmslogo.png

Laser App. Systems

4JMSolutions offers a wide range of Laser Application Systems ranging from Laser Marking equipment for Wafers, Substrates, Lead Frames and Devices to Laser applications used for Patterning and Repair Systems. UV and CO2 Cutting systems are also amongst our products offering Half or Full cut to the highest of standards and quality.

Some Of Our Laser App. System Machines

UV Cutting System

Eagle X5065C Laser Cutting System with UV Laser Apply : Pi Film, Coverlay, PCB, FPCB, RF-PCB, SLP, PPG, Cu Plate, Ag Plate, etc. Cutting Application

Read More »

CO2 Cutting System

Eagle X5200G Laser Cutting Application Cutting Application by CO2 Wavelength Film Cutting Beam Spot Size Control : Max 100㎛ ~ Max. Cutting Speed : Max

Read More »

Related Front End Products

Laser App. Systems

4JMSolutions offers a wide range of Laser Application Systems ranging from Laser Marking equipment for Wafers, Substrates, Lead Frames and Devices to Laser applications used

Read More »

Wafer AOI System

4JMSolutions Wafer Level AOI allows you to inspect wafers without contact, picking and/or placing. Uploading the results to host server with Wafer Mapping to be

Read More »

Die Sorters with AOI

4JMSolutions offers a wide variety of Wafer sorters, Wafer to Wafer reconstruction, Wafer to TnR [Tape and Reel], Wafer to JEDEC Tray or any other

Read More »

Die Bonders

4JMSolutions supports its customers through providing solutions also for Die Bonding though our Chip and/or Die to Substrate or Leadframe bonding. Supporting a turnkey solution

Read More »

Flip Chip

4JMSolutions provides the latest in one of the most recent technologies of Flip Chip bonding though is world renowned suppliers providing solutions for this space

Read More »