Laser Repair Application

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Eagle X7120RE

Laser Repair Application
Repairing Application by IR Wavelength
Equipment to open the short part of each channel in ag paste using laser
Beam Spot Size Control : Max 15㎛ 이하
Max. Repair Speed : 3,000㎜/Sec
Work table size : 70” and As follow user specification

Laser Direct Patterning System with IR Laser

Eagle X7150H Laser Direct Patterning System with IR Laser Fine Pitch patterning using Laser and Scan Head Apply : Silver Paste and Transparent Electrode (ITO,

UV Cutting System

Eagle X5065C Laser Cutting System with UV Laser Apply : Pi Film, Coverlay, PCB, FPCB, RF-PCB, SLP, PPG, Cu Plate, Ag Plate, etc. Cutting Application

CO2 Cutting System

Eagle X5200G Laser Cutting Application Cutting Application by CO2 Wavelength Film Cutting Beam Spot Size Control : Max 100㎛ ~ Max. Cutting Speed : Max

Trooper-L Wafer-Level Laser Marking Handler

Trooper-L Wafer-Level Laser Marking Handler It is an innovative wafer-level laser marking handler which offers high precision laser marking capable of achieving an accuracy reading

Company

4JMSolutions (Malta) Ltd. was founded in 2008 on a solid base of international servicing and more than 25 years of high end industrial experience. Based on the solid principal of providing solutions where the equipment offered is a biproduct of the solution.