At 4JMSolutions, we specialize in next-generation test handler machines, specifically designed for wafer die and package vision and electrical tests. We understand that in the rapidly advancing realm of semiconductors, precision and efficiency are paramount. Thus, we’ve introduced an array of specialized equipment that leverages the cutting edge in semiconductor testing equipment.
Our flagship GIDEON series stand out as a testament to our commitment to innovation. This series consists of single tray-to-tray handlers, impeccably integrated to dock onto up to three test cells. This ensures unmatched flexibility and reusability, adapting to ever-evolving semiconductor requirements. Such test handler semiconductor machines are a testament to our expertise, handling a plethora of smart sensors, including Structured Light 3D Sensors, Proximity Sensors, Time of Flight 3D Sensors, Ambient Light Sensors, and beyond.
What makes our machines stand out? Take the Structured Light 3D Sensor Machine, for instance. It offers a UPH ranging from 600 to 1200, contingent on the package and machine configuration. This handler provides both JEDEC Tray input and output, ensuring seamless integration into existing systems. Moreover, the advanced Vision Capabilities feature ensures impeccable 2D Matrix Inspection, boasting an accuracy down to 0.3mmX 0.3mm. The six-sided AOI Inspection coupled with the vision accuracy of 10µm ensures that no defect goes unnoticed.
Yet, it’s not just about vision capabilities. Our test capabilities encompass comprehensive tests like LIV Sweep & Wavelength Test, incorporating parameters like Current Leakage, Forward Voltage, Power Conversion Efficiency (PCE), and more. For comprehensive coverage, the Time of Flight 3D Sensor Machine includes a Tri-Temperature Test ranging from -40C to 150C.
Moreover, 4JMSolutions extends its prowess to the Image Sensor Test Machine, crafted for specialized tests such as the Electrical Functional Test and the Edge Spatial Frequency Response. The Micro LED Test Machine, on the other hand, is perfectly equipped for exhaustive tests like the Colorimeter Image Test and the Electrical Functional Test, ensuring every semiconductor aspect is comprehensively analyzed.
For those seeking advanced power solutions, the Wafer-Level Power device Burn-in Test Handler Machine and the Module-Level Power Device Burn-in Test Handler Machine offer unmatched capabilities. With up to 480 die test parallelism per wafer and 720 power module test parallelism respectively, they represent the pinnacle of efficiency.
Trooper-BI Wafer-Level VCSEL/LED/Micro LED Burn-in Test Handler It is the latest wafer-level burn in test system designed for power devices This innovative tester accommodates 2
PM31 PM35-T PM38-T Turret Test and Vision Handler A high speed turret test & vision handler designed for Discrete & ICs testing. It performs vision
NX1032XS UPH up to 20,000 32-site simultaneous test capability. Smart Motion Control robot control technology enables fast movement with low vibration when transferring semiconductors. Request
NS8080MS / NS8160MS High UPH Standard contact pressure sufficient for high-speed Testing of high-pin-count chips. Support for high temperatures up to 155degC. Support for wide
NS8040SH / NS8080SH Dual Temp Handler. 4sites /8sites test capability. Stable operation with affordable prices. Request More Information Related Test & Finishing, Pick and Place
JLS-3000 16 Para System LSI Test Handler Sorter capability can be adopted on final stage of process Efficient design of Loading, Shuttle, Test Site, Unloading
JOQ-800 Merge the Device from Partial Tray to Full Tray Pre-Screen available : DC Test before merge to Full Tray Device : All types of
JPS-3000 An integrated automation system that enables simultaneous probing and sorting of LED chips Chip alignment by image processing and Sorting after Electrical and optical