At 
4JMSolutions, we specialize in next-generation test handler machines, specifically designed for wafer die and package vision and electrical tests. We understand that in the rapidly advancing realm of semiconductors, precision and efficiency are paramount. Thus, we’ve introduced an array of specialized equipment that leverages the cutting edge in semiconductor testing equipment.
Our flagship GIDEON series stand out as a testament to our commitment to innovation. This series consists of single tray-to-tray handlers, impeccably integrated to dock onto up to three test cells. This ensures unmatched flexibility and reusability, adapting to ever-evolving semiconductor requirements. Such test handler semiconductor machines are a testament to our expertise, handling a plethora of smart sensors, including Structured Light 3D Sensors, Proximity Sensors, Time of Flight 3D Sensors, Ambient Light Sensors, and beyond.
What makes our machines stand out? Take the Structured Light 3D Sensor Machine, for instance. It offers a UPH ranging from 600 to 1200, contingent on the package and machine configuration. This handler provides both JEDEC Tray input and output, ensuring seamless integration into existing systems. Moreover, the advanced Vision Capabilities feature ensures impeccable 2D Matrix Inspection, boasting an accuracy down to 0.3mmX 0.3mm. The six-sided AOI Inspection coupled with the vision accuracy of 10µm ensures that no defect goes unnoticed.
Yet, it’s not just about vision capabilities. Our test capabilities encompass comprehensive tests like LIV Sweep & Wavelength Test, incorporating parameters like Current Leakage, Forward Voltage, Power Conversion Efficiency (PCE), and more. For comprehensive coverage, the Time of Flight 3D Sensor Machine includes a Tri-Temperature Test ranging from -40C to 150C.
Moreover, 4JMSolutions extends its prowess to the Image Sensor Test Machine, crafted for specialized tests such as the Electrical Functional Test and the Edge Spatial Frequency Response. The Micro LED Test Machine, on the other hand, is perfectly equipped for exhaustive tests like the Colorimeter Image Test and the Electrical Functional Test, ensuring every semiconductor aspect is comprehensively analyzed.
For those seeking advanced power solutions, the Wafer-Level Power device Burn-in Test Handler Machine and the Module-Level Power Device Burn-in Test Handler Machine offer unmatched capabilities. With up to 480 die test parallelism per wafer and 720 power module test parallelism respectively, they represent the pinnacle of efficiency.
Structured Light 3D Sensor Our GIDEON series comprise of a single tray to tray handler which is dock-able onto either a single test cell or
Proximity Sensor Our GIDEON series comprise of a single tray to tray handler which is dock-able onto either a single test cell or up to
Time of Flight 3D Sensor Our GIDEON series comprise of a single tray to tray handler which is dock-able onto either a single test cell
Ambient Light Sensor Our GIDEON series comprise of a single tray to tray handler which is dock-able onto either a single test cell or up
Edge Emitting Laser Module 1OC Laser Module Tester offers a Full Turnkey Solution designed for Laser module testing. By using an integrating sphere, it will
Image Sensor Our GIDEON series comprise of a single tray to tray handler which is dock-ableonto either a single test cell or up to 3
Spectrum Sensor Our GIDEON series comprise of a single tray to tray handler which is dock-able onto either a single test cell or up to
Micro LED Our GIDEON series comprise of a single tray to tray handler which is dock-able onto either a single test cell or up to
LIDAR Sensor LiDAR which stands for Light Detection and Ranging is essentially a sonar that use pulsed laser waves to map the distance to Surrounding
Motion Sensor A full turnkey solution designed to solve the complex test of MEMS motion sensors uses both a flexible flipper & rotator to simulate
Trooper-BI Wafer-Level VCSEL/LED/Micro LED Burn-in Test Handler It is the latest wafer-level burn in test system designed for power devices This innovative tester accommodates 2
Wafer-Level Power device Burn-in Test Handler It is the latest wafer-level burn in test system designed for power devices This innovative tester accommodates 2 wafer
Module-Level Power Device Burn-in Test Handle It is the latest module-level burn-in test system designed for power devices his innovate tester accommodates 720 power module
Queen-QCD IQC DOE Tester IQC DOE Tester is an innovative tester designed to test the imaging characteristics of DOE. Light pattern is captured and analysed
Queen-QCL IQC Lens Tester IQC Lens Tester is designed to test the optical characteristics of Optical Lens. The tester will analyse the beam transmission efficiency
PM35-T Turret Test and Vision Handler A high speed turret based test &vision handler designed to test Power Devices. It performs vision inspection and electrical functional
PM62/63 Ambient/ Hot Test & Vision Handler An ambient and elevated temperature test handler designed to test Power Devices. Test Options include electrical Functional test,
Wafer-Level Power device Burn-in Test Handler It is the latest wafer-level burn in test system designed for power devices This innovative tester accommodates 2 wafer
Module-Level Power Device Burn-in Test Handle It is the latest module-level burn-in test system designed for power devices his innovate tester accommodates 720 power module
PM52-T Power Module Test Handler A linear pick & place concept test handler designed to perform high current & power test onto Intelligent Power Modules
PM31 PM35-T PM38-T Turret Test and Vision Handler A high speed turret test & vision handler designed for Discrete & ICs testing. It performs vision
PM63 Ambient Hot Test and Vision Handler An ambient and elevated temperature test handler designed for Discrete & ICs testing Test Options include Electrical Functional
NX1032XS UPH up to 20,000 32-site simultaneous test capability. Smart Motion Control robot control technology enables fast movement with low vibration when transferring semiconductors. Request
NS8080MS / NS8160MS High UPH Standard contact pressure sufficient for high-speed Testing of high-pin-count chips. Support for high temperatures up to 155degC. Support for wide
NS8040SH / NS8080SH Dual Temp Handler. 4sites /8sites test capability. Stable operation with affordable prices. Request More Information Related Test & Finishing, Pick and Place
Dual Temp Handler S9 Series S9 Series has responded recent market trend which is handling smallest devices with Dual Temperature handler. 1. High Accuracy Temperature
Tri-Temp Handler SX2400 “World’s Best” Multi-channel high speed Tri-Temp Handler. Continuous long hours of operation time(72hrs) Archive high performance and Low Jam rate 1/5,000 Low
Customizable Handler S1 Series Laser Direct Patterning System with IR Laser Fine Pitch patterning using Laser and Scan Head Apply : Silver Paste and Transparent
JAC-64K 64 Para System LSI Test Handler Sorter capability can be adopted on final stage of process Efficient design of Loading, Shuttle, Test Site, Unloading
JLS-3000 16 Para System LSI Test Handler Sorter capability can be adopted on final stage of process Efficient design of Loading, Shuttle, Test Site, Unloading
JLS-3100 Global Test Handler High Contact Force (1000 kgf) Individual Temperature Control Function Direct Heater Heating Method Easy Operation, Easy Maintenance Main Power : 200-240VAC
JDP-3800 8 Para Simple Test Handler Merge the Device from Partial Tray to Full Tray Pre-Screen available : DC Test before merge to Full Tray
JOQ-800 Merge the Device from Partial Tray to Full Tray Pre-Screen available : DC Test before merge to Full Tray Device : All types of
JTM-3000 Automated Lot Merge System Load / Unload Lots from LIS System Motion Control : Linear Motion Guide System with Servo Motors (Max. 50W to
Eagle SS8000 4 para SSD Sorter SSD Test Board Loading / Unloading / Exchange Mode Unloading SSD with Bin sorting capability Auto Conversion (Conversion Kit-less)
JRS-3000 SSD Module can applied SSD Module Sorting : sorted by Magazine Loading & Unloading Initial Test result shares by TCP/IP connection to Handler Using
JCP-3000 Automated sorting equipment with various kinds of LED Chip Vision Inspection. Chip performance measurement by wafer-probing test. Electrical and optical characteristics are measured by
JCS-3000 Full Auto Sorting Machine Chip sorting through image processing by automatically loading several rings in the magazine Motion Control : Linear Motion Guide System
JPS-3000 An integrated automation system that enables simultaneous probing and sorting of LED chips Chip alignment by image processing and Sorting after Electrical and optical
Memory Testing Handler The package test measures the electrical characteristics, functional characteristics, and operating speed of the product by putting the semiconductor into the tester
4JMSolutions (Malta) Ltd. was founded in 2008 on a solid base of international servicing and more than 25 years of high end industrial experience. Based on the solid principal of providing solutions where the equipment offered is a biproduct of the solution.
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