The transformative wave of miniaturization and enhanced connectivity in the semiconductor world is largely driven by pioneering technologies like flip chip bonding. 4JMSolutions, with its cutting-edge machinery, is at the forefront of this innovation, ensuring that this intricate bonding method is not just achievable, but also seamless and efficient.
Some of the revolutionary flip chip bonder machines from 4JMSolutions:
As the name suggests, the Eagle A3000 is an automated marvel designed specifically for the rigorous demands of flip chip technology. With the capability to pick and place good chips from a wafer directly to a substrate wafer, it’s optimized for the fan-out WLP process. Handling up to a 12-inch wafer size, its multi-spindle head ensures an impressive UPH of 10,000 EA. But it’s not just about speed; the machine boasts an accuracy of [X/Y] ±5.0㎛ and [Theta] ±0.05° for global alignment. With dimensions of 2,320(L) x 2,140(W) x 1,570(H) mm and weighing approximately 2,950 kg, the Eagle A3000 is a robust machine ready to redefine the flip chip bonding paradigm.
This machine is a masterclass in Wafer Level Chip Scale Package Tape & Reel processes. Featuring dual output reel capabilities and incorporating comprehensive inspection processes like wafer, mark, under, place, and OTI vision inspection, it stands as a testament to 4JMSolutions’ commitment to quality and precision. Designed for both easy operation and maintenance, its dimensions stand at 1,640 (L) x 1,460 (W) x 1,650 (H) mm, with an approximate weight of 3,600 kg.