WLCSP T&R – Eagle V3500
WLCSP T&R – Eagle V3500 WLCSP Tape & Reel Dual Output Reel Wafer, Mark, Under, Place, OTI Vision Inspection Easy Operation, Easy Maintenance Main Power
The transformative wave of miniaturization and enhanced connectivity in the semiconductor world is largely driven by pioneering technologies like flip chip bonding. 
4JMSolutions, with its cutting-edge machinery, is at the forefront of this innovation, ensuring that this intricate bonding method is not just achievable, but also seamless and efficient.
Some of the revolutionary flip chip bonder machines from 4JMSolutions:
As the name suggests, the Eagle A3000 is an automated marvel designed specifically for the rigorous demands of flip chip technology. With the capability to pick and place good chips from a wafer directly to a substrate wafer, it’s optimized for the fan-out WLP process. Handling up to a 12-inch wafer size, its multi-spindle head ensures an impressive UPH of 10,000 EA. But it’s not just about speed; the machine boasts an accuracy of [X/Y] ±5.0㎛ and [Theta] ±0.05° for global alignment. With dimensions of 2,320(L) x 2,140(W) x 1,570(H) mm and weighing approximately 2,950 kg, the Eagle A3000 is a robust machine ready to redefine the flip chip bonding paradigm.
This machine is a masterclass in Wafer Level Chip Scale Package Tape & Reel processes. Featuring dual output reel capabilities and incorporating comprehensive inspection processes like wafer, mark, under, place, and OTI vision inspection, it stands as a testament to 4JMSolutions’ commitment to quality and precision. Designed for both easy operation and maintenance, its dimensions stand at 1,640 (L) x 1,460 (W) x 1,650 (H) mm, with an approximate weight of 3,600 kg.
WLCSP T&R – Eagle V3500 WLCSP Tape & Reel Dual Output Reel Wafer, Mark, Under, Place, OTI Vision Inspection Easy Operation, Easy Maintenance Main Power
Flip Chip Placer – Eagle A3000 Automated Flip-Chip Pick & Placer Auto Pick up position alignment Pick & Place the Good Chip from Wafer to
The Vanguard of Flip Chip Bonding Technology The transformative wave of miniaturization and enhanced connectivity in the semiconductor world is largely driven by pioneering technologies
4JMSolutions – Pioneering Excellence with Advanced Die Bonder Machines Die bonding, often regarded as the heartbeat of the semiconductor assembly process, finds its true innovation
Die Sorter Machines 4JMSolutions takes pride in its lineup of state-of-the-art Die Sorter Machines, which come fully integrated with AOI (Automated Optical Inspection) systems. Die
4JMSolutions is proud to offer advanced wafer Automatic Optical Inspection (AOI) systems from leading manufacturers. These systems play a crucial role in the semiconductor manufacturing
The Trooper-BI Wafer-Level VCSEL/LED/Micro LED Burn-in wafer level testing system is highly versatile and can accommodate a wide range of units, up to 7,200 at
Our Laser Application Systems for semiconductor manufacturing offer a range of wafer cutting and dicing solutions, including laser-based methods that provide precise and efficient processing.
4JMSolutions (Malta) Ltd. was founded in 2008 on a solid base of international servicing and more than 25 years of high end industrial experience. Based on the solid principal of providing solutions where the equipment offered is a biproduct of the solution.