Flip Chip Placer – Eagle A3000

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Flip Chip Placer - Eagle A3000

Automated Flip-Chip Pick & Placer
Auto Pick up position alignment
Pick & Place the Good Chip from Wafer to Substrate Wafer
Optimized for Fan-out WLP process
Maximum Wafer Size : 12 Inch Wafer
Multi Spindle Head
UPH : 10,000 EA
Accuracy : [X/Y] ±5.0㎛, [Theta] ±0.05° (Global alignment)
Main Power : VAC 220, 3 Phase / 50~60 Hz
Air Pressure : 5~6 kgf/cm2 / 250 LPM
M/C Dimension : 2,320(L) x 2,140(W) x 1,570(H) (mm)
Weight : About 2,950 kg

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Flip Chip Placer – Eagle A3000

Flip Chip Placer – Eagle A3000 Automated Flip-Chip Pick & Placer Auto Pick up position alignment Pick & Place the Good Chip from Wafer to

Company

4JMSolutions (Malta) Ltd. was founded in 2008 on a solid base of international servicing and more than 25 years of high end industrial experience. Based on the solid principal of providing solutions where the equipment offered is a biproduct of the solution.