Queen-AAC AA Collimator Module
Queen-AAC AA Collimator Module It is designed to actively align & assemble together Laser Module and Lens Module into a Collimator Module by using High
4JMSolutions offers a wide range Active Alignment Assembly which is designed to actively align & assemble together
Collimator Module with DOE Module into a Projector,
Optical Lens and VCSEL Inner Housing into a Lens Module,
DOE Lens with VCSEL Outer Housing into a DOE Module,
Laser Module and Lens Module into a Collimator Module,
The Final & Complete Product by using High Precision Glue Dispenser and High Accuracy Vision Technologies. The Handler’s in-built Glue Dispenser is integrated with top vision to detect & obtain the positions of the housing to be dispensed with glue. The Glue Dispenser uses a Screw Headed Valve which enables it to perform high viscosity and small diameter glue dispensing with high precision & accuracy. By using multiple vision stations, they capture the X Y coordinates of both the Projector and Housing while aligning & positioning them accordingly before assembling them both together Curing time only takes <1 sec by using UV Light to perform the job.
Queen-AAC AA Collimator Module It is designed to actively align & assemble together Laser Module and Lens Module into a Collimator Module by using High
Queen-AAD DOE Module It is design to actively align & assemble together DOE Lens with VCSEL Outer Housing into a DOE Module by using High
Queen-AAL Lens + Inner Housing Assembly It offers a Complete Solution to actively align & assemble together Optical Lens and VCSEL Inner Housing into a
Queen-AAP AA Projector It is designed to actively align & assemble together Collimator Module with DOE Module into a Projector, the Final & Complete Product
4JMSolutions offers a wide range of Laser Application Systems ranging from Laser Marking equipment for Wafers, Substrates, Lead Frames and Devices to Laser applications used
4JMSolutions Wafer Level AOI allows you to inspect wafers without contact, picking and/or placing. Uploading the results to host server with Wafer Mapping to be
4JMSolutions offers a wide variety of Wafer sorters, Wafer to Wafer reconstruction, Wafer to TnR [Tape and Reel], Wafer to JEDEC Tray or any other
4JMSolutions supports its customers through providing solutions also for Die Bonding though our Chip and/or Die to Substrate or Leadframe bonding. Supporting a turnkey solution
4JMSolutions provides the latest in one of the most recent technologies of Flip Chip bonding though is world renowned suppliers providing solutions for this space
4JMSolutions (Malta) Ltd. was founded in 2008 on a solid base of international servicing and more than 25 years of high end industrial experience. Based on the solid principal of providing solutions where the equipment offered is a biproduct of the solution.
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