Die Sorters with AOI

Die Sorter Machines

4JMSolutions takes pride in its lineup of state-of-the-art Die Sorter Machines, which come fully integrated with AOI (Automated Optical Inspection) systems. Die sorting has long been a cornerstone in semiconductor manufacturing, ensuring that individual chips, or ‘dies’, are effectively organized post the dicing process. With the integration of AOI, the accuracy, efficiency, and reliability of die sort processes are significantly enhanced.

Here are some standout models available at 4JMSolutions:

• C340 Wafer to Tape and Reel Machine
  A master in wafer sorting and wafer-to-tape & reel operations, this die sorter machine boasts an impressive SUPH (Sorted Units Per Hour) of up to 40,000. Designed to handle die sizes ranging from 0.2×0.4mm to 8x8mm, it’s not just speed that it offers; the C340 comes integrated with specialized features for die crack inspection and a reel auto changer (RAC) mechanism, proving its prowess in multi-die O/S testing and reel-to-reel processes.

• C530 & C330 Machines
  While both these machines are remarkable in wafer-to-tape & reel processes and come equipped with RAC, the C530 stands out with its SWIR/NIR die crack inspection capability, managing an SUPH up to 45,000. The C330, with its dynamic drive rotary and die side wall inspection for defects as minuscule as ≥10µm, ensures precision in every die sort.

• FS600 Die Transfer Wafer to JEDEC Tray Machine
  Specially designed for transferring dies from wafer to JEDEC trays, the FS600 offers a binning option with an SUPH of up to 6,000. It handles larger die sizes, ranging from 2x2mm to 21x21mm, and incorporates both flip and non-flip modes.

• Optimus Series: The Future of Die Sorting
  Both the Optimus MR3 and Optimus 2 are pioneers in wafer-to-wafer die sorting. While the MR3 boasts a 6-side inspection feature with a placement accuracy of +/- 30µm, the Optimus 2 is the epitome of precision. It integrates vibration isolators to enhance placement accuracy, vision-aided die position correction, wafer mapping capabilities, and a sophisticated recipe management system.