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C530 Die Sorter Wafer to Tape and Reel

C530 Wafer to Tape and Reel
  • Die Sorter
  • Wafer to Tape & Reel
  • SUPH up to 45,000
  • Die Size: 0.2×0.4mm to 8x8mm
  • SWIR / NIR Die Crack Inspection
  • 2nd Taper, Reel to Reel, Multi-Die
  • Reel Auto Changer (RAC)

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