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C330 Die Sorter Wafer to Tape and Reel

C330 Wafer to Tape and Reel
  • Die sorter
  • Wafer to Tape & Reel
  • SUPH up to 30,000 (Flip mode)
  • Die Side Wall Inspection ≥10µm Defect Size
  • Conversion < 30 mins
  • Dynamic Drive Rotary with Short Setting Time
  • NIR, Reel Auto Changer (RAC)

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