C530 Wafer Sorter Wafer to Tape and Reel
C530 Wafer to Tape and Reel Wafer Sorter Wafer to Tape & Reel SUPH up to 45,000 Die Size: 0.2×0.4mm to 8x8mm SWIR / NIR
4JMSolutions offers a wide variety of Wafer sorters, we it Wafer to Wafer reconstruction, Wafer to TnR [Tape and Reel], Wafer to JEDEC Tray or any other output media which is required be it a single or dual output. Using high quality components to achieve minimal tolerances and incorporating Testing and Vision Inspections where needed 4JMSolutions can provide a complete solution for all Wafer an Die Sorting needs.
Vision inspection is a standard feature in most of the below sorters.
C530 Wafer to Tape and Reel Wafer Sorter Wafer to Tape & Reel SUPH up to 45,000 Die Size: 0.2×0.4mm to 8x8mm SWIR / NIR
C330 Wafer to Tape and Reel Wafer sorter Wafer to Tape & Reel SUPH up to 30,000 (Flip mode) Die Side Wall Inspection ≥10µm Defect
FS600 Die Transfer Wafer to JEDEC Tray Wafer Sorter Die Transfer from Wafer to Jedec Tray SUPH up to 6,000 Die Size 2x2mm to 21x21mm
FS500 Die Transfer Wafer to JEDEC Tray Wafer Sorter Component Transfer from Magazine to Jedec Tray SUPH up to 5,000 Die Size 3x3mm to 10x10mm
Optimus MR3 Wafer to Wafer Wafer Sorter Wafer to Wafer SUPH up to 15,000 Die Size 0.5×0.5mm to 15x15mm Placement Accuracy +/- 30µm 6Side Inspection
Optimus 2 Wafer to Wafer [Single input – Dual output] Wafer Sorter Wafer to Wafer Vision-aided die position correction ensures die placement accuracy Integrated vibration
4JMSolutions offers a wide range of Laser Application Systems ranging from Laser Marking equipment for Wafers, Substrates, Lead Frames and Devices to Laser applications used
4JMSolutions Wafer Level AOI allows you to inspect wafers without contact, picking and/or placing. Uploading the results to host server with Wafer Mapping to be
4JMSolutions offers a wide variety of Wafer sorters, Wafer to Wafer reconstruction, Wafer to TnR [Tape and Reel], Wafer to JEDEC Tray or any other
4JMSolutions supports its customers through providing solutions also for Die Bonding though our Chip and/or Die to Substrate or Leadframe bonding. Supporting a turnkey solution
4JMSolutions provides the latest in one of the most recent technologies of Flip Chip bonding though is world renowned suppliers providing solutions for this space
4JMSolutions (Malta) Ltd. was founded in 2008 on a solid base of international servicing and more than 25 years of high end industrial experience. Based on the solid principal of providing solutions where the equipment offered is a biproduct of the solution.
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