JAP-3000 Pick & Place System for pre-inspected wafer
JAP-3000 Pick & Place System for pre-inspected wafer Automatic Pick & Place System for pre-inspected wafer Wafer to Tray process Easy to apply various DDI
JAP-3000 Pick & Place System for pre-inspected wafer Automatic Pick & Place System for pre-inspected wafer Wafer to Tray process Easy to apply various DDI
Optimus MR3 Wafer to Wafer Wafer Sorter Wafer to Wafer SUPH up to 15,000 Die Size 0.5×0.5mm to 15x15mm Placement Accuracy +/- 30µm 6Side Inspection
FS500 Die Transfer Wafer to JEDEC Tray Wafer Sorter Component Transfer from Magazine to Jedec Tray SUPH up to 5,000 Die Size 3x3mm to 10x10mm
C330 Wafer to Tape and Reel Wafer sorter Wafer to Tape & Reel SUPH up to 30,000 (Flip mode) Die Side Wall Inspection ≥10µm Defect
C340 Wafer to Tape and Reel Wafer Sorter Wafer to Tape & Reel SUPH up to 40,000 Die Size: 0.2×0.4mm to 8x8mm Die Crack Inspection
C530 Wafer to Tape and Reel Wafer Sorter Wafer to Tape & Reel SUPH up to 45,000 Die Size: 0.2×0.4mm to 8x8mm SWIR / NIR
4JMSolutions (Malta) Ltd. was founded in 2008 on a solid base of international servicing and more than 25 years of high end industrial experience. Based on the solid principal of providing solutions where the equipment offered is a biproduct of the solution.