C330 Wafer sorter Wafer to Tape and Reel

JAP-3000 Pick & Place System for pre-inspected wafer Automatic Pick & Place System for pre-inspected wafer Wafer to Tray process Easy to apply various DDI

Optimus 2 Wafer to Wafer [Single input – Dual output] Wafer Sorter Wafer to Wafer Vision-aided die position correction ensures die placement accuracy Integrated vibration

FS500 Die Transfer Wafer to JEDEC Tray Wafer Sorter Component Transfer from Magazine to Jedec Tray SUPH up to 5,000 Die Size 3x3mm to 10x10mm

FS600 Die Transfer Wafer to JEDEC Tray Wafer Sorter Die Transfer from Wafer to Jedec Tray SUPH up to 6,000 Die Size 2x2mm to 21x21mm

C340 Wafer to Tape and Reel Wafer Sorter Wafer to Tape & Reel SUPH up to 40,000 Die Size: 0.2×0.4mm to 8x8mm Die Crack Inspection

C530 Wafer to Tape and Reel Wafer Sorter Wafer to Tape & Reel SUPH up to 45,000 Die Size: 0.2×0.4mm to 8x8mm SWIR / NIR