JAP-3000 Pick & Place System for pre-inspected wafer

JAP-3100 Pick & Place System with Vision inspection Automatic Pick & Place System with Vision inspection Wafer handling by magazine : Auto Wafer Loading &

Optimus 2 Wafer to Wafer [Single input – Dual output] Wafer Sorter Wafer to Wafer Vision-aided die position correction ensures die placement accuracy Integrated vibration

Optimus MR3 Wafer to Wafer Wafer Sorter Wafer to Wafer SUPH up to 15,000 Die Size 0.5×0.5mm to 15x15mm Placement Accuracy +/- 30µm 6Side Inspection

FS600 Die Transfer Wafer to JEDEC Tray Wafer Sorter Die Transfer from Wafer to Jedec Tray SUPH up to 6,000 Die Size 2x2mm to 21x21mm

C330 Wafer to Tape and Reel Wafer sorter Wafer to Tape & Reel SUPH up to 30,000 (Flip mode) Die Side Wall Inspection ≥10µm Defect

C340 Wafer to Tape and Reel Wafer Sorter Wafer to Tape & Reel SUPH up to 40,000 Die Size: 0.2×0.4mm to 8x8mm Die Crack Inspection