C530 Wafer to Tape and Reel Wafer Sorter Wafer to Tape & Reel SUPH up to 45,000 Die Size: 0.2×0.4mm to 8x8mm SWIR / NIR
C340 Wafer to Tape and Reel Wafer Sorter Wafer to Tape & Reel SUPH up to 40,000 Die Size: 0.2×0.4mm to 8x8mm Die Crack Inspection
C330 Wafer to Tape and Reel Wafer sorter Wafer to Tape & Reel SUPH up to 30,000 (Flip mode) Die Side Wall Inspection ≥10µm Defect
FS500 Die Transfer Wafer to JEDEC Tray Wafer Sorter Component Transfer from Magazine to Jedec Tray SUPH up to 5,000 Die Size 3x3mm to 10x10mm
Optimus 2 Wafer to Wafer [Single input – Dual output] Wafer Sorter Wafer to Wafer Vision-aided die position correction ensures die placement accuracy Integrated vibration
JAP-3000 Pick & Place System for pre-inspected wafer Automatic Pick & Place System for pre-inspected wafer Wafer to Tray process Easy to apply various DDI
4JMSolutions (Malta) Ltd. was founded in 2008 on a solid base of international servicing and more than 25 years of high end industrial experience. Based on the solid principal of providing solutions where the equipment offered is a biproduct of the solution.
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