JAP-3100 Pick & Place System with Vision inspection

C530 Wafer to Tape and Reel Wafer Sorter Wafer to Tape & Reel SUPH up to 45,000 Die Size: 0.2×0.4mm to 8x8mm SWIR / NIR

C340 Wafer to Tape and Reel Wafer Sorter Wafer to Tape & Reel SUPH up to 40,000 Die Size: 0.2×0.4mm to 8x8mm Die Crack Inspection

C330 Wafer to Tape and Reel Wafer sorter Wafer to Tape & Reel SUPH up to 30,000 (Flip mode) Die Side Wall Inspection ≥10µm Defect

FS500 Die Transfer Wafer to JEDEC Tray Wafer Sorter Component Transfer from Magazine to Jedec Tray SUPH up to 5,000 Die Size 3x3mm to 10x10mm

Optimus 2 Wafer to Wafer [Single input – Dual output] Wafer Sorter Wafer to Wafer Vision-aided die position correction ensures die placement accuracy Integrated vibration

JAP-3000 Pick & Place System for pre-inspected wafer Automatic Pick & Place System for pre-inspected wafer Wafer to Tray process Easy to apply various DDI