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JAP-3100 Pick & Place System with Vision inspection

JAP-3100 Pick & Place System with Vision inspection
  • Automatic Pick & Place System with Vision inspection
  • Wafer handling by magazine : Auto Wafer Loading & Unloading
  • Motion System : 11 Axis Servo Motor, Linear Motion Guide system
  • High Precision positioning with accuracy of 0.01mm by incremental positioning
  • 2Para on Single Head improves speed and accuracy
  • High Speed Pick & Place
  • Wafer to Tray process (Small Device)
  • Main Power : 230V±10%, 50/60Hz, 3Phase
  • Air Pressure : 5 ㎏/㎠ (Supply Inlet Port : PT1/2)
  • M/C Dimension : 1635 (L) x 1385 (W) x 1400 (H)
  • Weight : Approx. 1,300 ㎏

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