Trooper-BI Wafer-Level VCSEL/LED/Micro LED Burn-in Test System
It is a full turnkey solution to probe & bum-in VCSEL LED substrate in wafer level. The tester is capable of testing up to 7
Home / Equipment / Semiconductor Machines And Manufacturing Equipment / Front-End / Wafer Level Burn in
The Trooper-BI Wafer-Level VCSEL/LED/Micro LED Burn-in wafer level testing system is highly versatile and can accommodate a wide range of units, up to 7,200 at once. The machine offers excellent pogo pin accuracy of +/-50 um, ensuring highly precise and reliable testing. Additionally, the burn-in duration is programmable, allowing for customized testing procedures tailored to specific needs. The source range of the system is 20mA-100mA/0.2A-1.5A 24V, with a measurement tolerance of 0.2mA +-1%, which ensures highly accurate measurements. The temperature range of 45-130C with 0.1C steps and the humidity level of < 85% RH, Non-condensing, ensure that the testing conditions remain stable throughout the process. The Trooper-BI Wafer-Level VCSEL/LED/Micro LED Burn-in Test System is a highly efficient and reliable machine with exceptional testing capabilities.
It is a full turnkey solution to probe & bum-in VCSEL LED substrate in wafer level. The tester is capable of testing up to 7
The Vanguard of Flip Chip Bonding Technology The transformative wave of miniaturization and enhanced connectivity in the semiconductor world is largely driven by pioneering technologies
4JMSolutions – Pioneering Excellence with Advanced Die Bonder Machines Die bonding, often regarded as the heartbeat of the semiconductor assembly process, finds its true innovation
Die Sorter Machines 4JMSolutions takes pride in its lineup of state-of-the-art Die Sorter Machines, which come fully integrated with AOI (Automated Optical Inspection) systems. Die
4JMSolutions is proud to offer advanced wafer Automatic Optical Inspection (AOI) systems from leading manufacturers. These systems play a crucial role in the semiconductor manufacturing
The Trooper-BI Wafer-Level VCSEL/LED/Micro LED Burn-in wafer level testing system is highly versatile and can accommodate a wide range of units, up to 7,200 at
Our Laser Application Systems for semiconductor manufacturing offer a range of wafer cutting and dicing solutions, including laser-based methods that provide precise and efficient processing.
4JMSolutions (Malta) Ltd. was founded in 2008 on a solid base of international servicing and more than 25 years of high end industrial experience. Based on the solid principal of providing solutions where the equipment offered is a biproduct of the solution.