Wafer Reconstruction

Wafer reconstruction is a pivotal procedure in semiconductor manufacturing. It pertains to the process of rearranging functional chips on sticky tape affixed to a wafer ring post the sawing phase. The essence is to transform standard 12-inch wafers into sizes like 8, 6, 5, or 4 inches, or even reorganize chips based on specific features or grades.

One exemplary wafer reconstruction machine to note is the “Trooper-V,” a high-speed, wafer-level AOI (Automated Optical Inspection) handler. With its groundbreaking Rotatable Lens Turret concept, Trooper-V is adept at catering to varied die sizes and types. Its diverse magnification levels, ranging from 2.0x to 7.0x, ensure unparalleled precision in wafer inspection. Notably, Trooper-V has an impressive efficiency rate, requiring a mere 2 minutes for the scrutiny of an entire wafer that may contain around 70,000 dies.

Some of its standout features include:

• An impressive throughput of over +30 wafers per hour.
• Compatibility with both raw wafer and Mylar wafer rings of sizes 6, 8, or 12 inches.
• An advanced microscope with both bright and dark field capabilities.
• Superior objective lens magnification for detailed die inspection.
• State-of-the-art light source illumination using RGB configuration.
• Incorporation of Short Wave Infrared (SWIR) imaging technology specifically tailored for SiC.
• Customizable wafer map generation and wafer map download capabilities.
• Pre-wafer alignment in X, Y, and angle dimensions.
• 6-side AOI which allows for grind inspection, crack inspection, edge inspection, and more.
• Die surface inspection capacities encompassing crack, chipping, misalignment, optical character recognition, and other potential defects.

Wafer reconstruction machines, epitomized by the Trooper-V, are essential tools in the semiconductor landscape, ensuring that each wafer undergoes rigorous quality checks before being deemed fit for use.