FC-1210 Chip to Substrate or Leadframe
FC-1210 Chip to Substrate or Leadframe SUPH up to 5,500 Die Size 0.5-6mm (6-20mm option) Bond Force Sensor Accuracy ±3µm local ±5µm global Face-up/Face-down; BH/Chunk
4JMSolutions supports its customers through providing solutions also for Die Bonding though our Chip and/or Die to Substrate or Leadframe bonding. Supporting a turnkey solution with inspection and high level of accuracy in placement.
FC-1210 Chip to Substrate or Leadframe SUPH up to 5,500 Die Size 0.5-6mm (6-20mm option) Bond Force Sensor Accuracy ±3µm local ±5µm global Face-up/Face-down; BH/Chunk
FC-1250 Chip to Substrate or Leadframe SUPH up to 15,000 Die size 0.3x8mm BH Force 0.5-10N Accuracy ±10µm Face-down; Dipping Request More Information Related Die
4JMSolutions offers a wide range of Laser Application Systems ranging from Laser Marking equipment for Wafers, Substrates, Lead Frames and Devices to Laser applications used
4JMSolutions Wafer Level AOI allows you to inspect wafers without contact, picking and/or placing. Uploading the results to host server with Wafer Mapping to be
4JMSolutions offers a wide variety of Wafer sorters, Wafer to Wafer reconstruction, Wafer to TnR [Tape and Reel], Wafer to JEDEC Tray or any other
4JMSolutions supports its customers through providing solutions also for Die Bonding though our Chip and/or Die to Substrate or Leadframe bonding. Supporting a turnkey solution
4JMSolutions provides the latest in one of the most recent technologies of Flip Chip bonding though is world renowned suppliers providing solutions for this space
4JMSolutions (Malta) Ltd. was founded in 2008 on a solid base of international servicing and more than 25 years of high end industrial experience. Based on the solid principal of providing solutions where the equipment offered is a biproduct of the solution.
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