Die bonding, often regarded as the heartbeat of the semiconductor assembly process, finds its true innovation in the technologically superior machines provided by 4JMSolutions. This crucial die attach process, which involves affixing a die/chip to a substrate or leadframe, is central to semiconductor fabrication. With the relentless pace of miniaturization and the ever-growing need for precision, choosing the right die bonder machine becomes paramount.
Introducing 4JMSolutions’ premier die bonder machines:
Redefining accuracy and efficiency, the FC-1210 is built to handle a wide range of die sizes from 0.5-6mm, with an extended option for 6-20mm. Boasting an impressive SUPH (Sorted Units Per Hour) of up to 5,500, its precision is undeniable with a local accuracy of ±3µm and a global accuracy of ±5µm. What sets this machine apart is the inclusion of a bond force sensor, ensuring optimal force application during the die bonding semiconductor process.
A true titan in the die bonder lineup, the FC-1250 is engineered for high-speed operations with a staggering SUPH of up to 15,000. Catering to die sizes of 0.3x8mm, this machine encapsulates versatility and precision. It integrates a BH Force range of 0.5-10N, ensuring gentle yet firm bonding. The machine’s accuracy stands at ±10µm, and it offers diverse bonding techniques: face-down dipping and a combination of face-up/face-down with BH/Chunk table heating and dipping.