FC-1250 Chip to Substrate or Leadframe
FC-1250 Chip to Substrate or Leadframe SUPH up to 15,000 Die size 0.3x8mm BH Force 0.5-10N Accuracy ±10µm Face-down; Dipping Request More Information Related Die
4JMSolutions – Pioneering Excellence with Advanced Die Bonder MachinesDie bonding, often regarded as the heartbeat of the semiconductor assembly process, finds its true innovation in the technologically superior machines provided by 4JMSolutions. This crucial die attach process, which involves affixing a die/chip to a substrate or leadframe, is central to semiconductor fabrication. With the relentless pace of miniaturization and the ever-growing need for precision, choosing the right die bonder machine becomes paramount.
Introducing 4JMSolutions’ premier die bonder machines:
Redefining accuracy and efficiency, the FC-1210 is built to handle a wide range of die sizes from 0.5-6mm, with an extended option for 6-20mm. Boasting an impressive SUPH (Sorted Units Per Hour) of up to 5,500, its precision is undeniable with a local accuracy of ±3µm and a global accuracy of ±5µm. What sets this machine apart is the inclusion of a bond force sensor, ensuring optimal force application during the die bonding semiconductor process.
A true titan in the die bonder lineup, the FC-1250 is engineered for high-speed operations with a staggering SUPH of up to 15,000. Catering to die sizes of 0.3x8mm, this machine encapsulates versatility and precision. It integrates a BH Force range of 0.5-10N, ensuring gentle yet firm bonding. The machine’s accuracy stands at ±10µm, and it offers diverse bonding techniques: face-down dipping and a combination of face-up/face-down with BH/Chunk table heating and dipping.
FC-1250 Chip to Substrate or Leadframe SUPH up to 15,000 Die size 0.3x8mm BH Force 0.5-10N Accuracy ±10µm Face-down; Dipping Request More Information Related Die
FC-1210 Chip to Substrate or Leadframe SUPH up to 5,500 Die Size 0.5-6mm (6-20mm option) Bond Force Sensor Accuracy ±3µm local ±5µm global Face-up/Face-down; BH/Chunk
The Vanguard of Flip Chip Bonding Technology The transformative wave of miniaturization and enhanced connectivity in the semiconductor world is largely driven by pioneering technologies
4JMSolutions – Pioneering Excellence with Advanced Die Bonder Machines Die bonding, often regarded as the heartbeat of the semiconductor assembly process, finds its true innovation
Die Sorter Machines 4JMSolutions takes pride in its lineup of state-of-the-art Die Sorter Machines, which come fully integrated with AOI (Automated Optical Inspection) systems. Die
4JMSolutions is proud to offer advanced wafer Automatic Optical Inspection (AOI) systems from leading manufacturers. These systems play a crucial role in the semiconductor manufacturing
The Trooper-BI Wafer-Level VCSEL/LED/Micro LED Burn-in wafer level testing system is highly versatile and can accommodate a wide range of units, up to 7,200 at
Our Laser Application Systems for semiconductor manufacturing offer a range of wafer cutting and dicing solutions, including laser-based methods that provide precise and efficient processing.
4JMSolutions (Malta) Ltd. was founded in 2008 on a solid base of international servicing and more than 25 years of high end industrial experience. Based on the solid principal of providing solutions where the equipment offered is a biproduct of the solution.