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FC-1210 Chip to Substrate or Leadframe

FC-1210 Chip to Substrate or Leadframe
  • SUPH up to 5,500
  • Die Size 0.5-6mm (6-20mm option)
  • Bond Force Sensor
  • Accuracy ±3µm local ±5µm global
  • Face-up/Face-down; BH/Chunk Table Heating; Dipping

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