FC-1250 Chip to Substrate or Leadframe
FC-1250 Chip to Substrate or Leadframe SUPH up to 15,000 Die size 0.3x8mm BH Force 0.5-10N Accuracy ±10µm Face-down; Dipping Request More Information Related Die
FC-1250 Chip to Substrate or Leadframe SUPH up to 15,000 Die size 0.3x8mm BH Force 0.5-10N Accuracy ±10µm Face-down; Dipping Request More Information Related Die
4JMSolutions (Malta) Ltd. was founded in 2008 on a solid base of international servicing and more than 25 years of high end industrial experience. Based on the solid principal of providing solutions where the equipment offered is a biproduct of the solution.