FC-1210 Chip to Substrate or Leadframe
FC-1210 Chip to Substrate or Leadframe SUPH up to 5,500 Die Size 0.5-6mm (6-20mm option) Bond Force Sensor Accuracy ±3µm local ±5µm global Face-up/Face-down; BH/Chunk
FC-1210 Chip to Substrate or Leadframe SUPH up to 5,500 Die Size 0.5-6mm (6-20mm option) Bond Force Sensor Accuracy ±3µm local ±5µm global Face-up/Face-down; BH/Chunk
4JMSolutions (Malta) Ltd. was founded in 2008 on a solid base of international servicing and more than 25 years of high end industrial experience. Based on the solid principal of providing solutions where the equipment offered is a biproduct of the solution.