CO2 Cutting System
Eagle X5200G Laser Cutting Application Cutting Application by CO2 Wavelength Film Cutting Beam Spot Size Control : Max 100㎛ ~ Max. Cutting Speed : Max
It is an innovative wafer-level laser marking handler which offers high precision laser marking capable of achieving an accuracy reading of +/-30um. The handler is designed with a Solid Granite Platform along with Anti-Vibration Absorbers to provide a well balance & well-aligned foundation to avoid misfiring of laser Using Advance Vision Systems, it ensures that the wafer is properly aligned before being mark as well as Live Feed View which allows the operator to monitor the entire marking process with the ability to capture images After marking, our vision system will also perform Post-Mark inspection to ensure that the end results meets the stringent requirements
Eagle X5200G Laser Cutting Application Cutting Application by CO2 Wavelength Film Cutting Beam Spot Size Control : Max 100㎛ ~ Max. Cutting Speed : Max
Eagle X5065C Laser Cutting System with UV Laser Apply : Pi Film, Coverlay, PCB, FPCB, RF-PCB, SLP, PPG, Cu Plate, Ag Plate, etc. Cutting Application
Eagle X7120RE Laser Repair Application Repairing Application by IR Wavelength Equipment to open the short part of each channel in ag paste using laser Beam
Eagle X7150H Laser Direct Patterning System with IR Laser Fine Pitch patterning using Laser and Scan Head Apply : Silver Paste and Transparent Electrode (ITO,
4JMSolutions (Malta) Ltd. was founded in 2008 on a solid base of international servicing and more than 25 years of high end industrial experience. Based on the solid principal of providing solutions where the equipment offered is a biproduct of the solution.