JAP-3000 Automatic Pick & Place System for Pre-Inspected Wafer
JAP-3000 Pick & Place System for pre-inspected wafer Automatic Pick & Place System for pre-inspected wafer Wafer to Tray process Easy to apply various DDI
JAP-3000 Pick & Place System for pre-inspected wafer Automatic Pick & Place System for pre-inspected wafer Wafer to Tray process Easy to apply various DDI
JAP-3100 Pick & Place System with Vision inspection Automatic Pick & Place System with Vision inspection Wafer handling by magazine : Auto Wafer Loading &
JAI-2000 2D / 3D Auto Vision System for package visual and marking of TSOP, BGA Types The Devices in the Loading Tray are inspected by
Eagle V8000 DDI Chip Auto Pick & Place and Vision Inspection Inline World first APS + AVI combination system Wafer Vision, Under Vision, Top Vision,
JAI-D302 Chip handled on Waffle Pack, Vision Check, Sorting, Unloading Reduced equipment operation time by Loader / Un-loader system Waffle Pack Warpage correction function Easily
Eagle V8500 3.5D vision inspection equipment Slit Beam Method : first PKG inspection application in Korea Ball Apex (3D Data) detection function using Slit Beam
4JMSolutions (Malta) Ltd. was founded in 2008 on a solid base of international servicing and more than 25 years of high end industrial experience. Based on the solid principal of providing solutions where the equipment offered is a biproduct of the solution.