| PRODUCT NAME | PCP-103SL | PCP-303N |
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PRODUCT IMAGE |
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| PRODUCT NAME | PCP-103SL | PCP-303N | ||
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FEATURES |
Development
concept |
Probing solution for the diced device WLCSP or Packaged Substrate (BGA, QFN, etc) by our original concept probing method. |
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Image
Processing |
XY Compensation (PFC original method) and Profiling perform Multi-die Probing by compensating the position shift by "warpage" or "sag" of film caused by film tension and dicer blade. |
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Record of Alignment success for customers' products is 100%. (In Japan) |
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Probing |
Multi-area probing is available when more than two package substrates are on a film frame.
Reconstructed wafer can be probed by the individual alignment. |
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Capable of Multi-TEG (more than 2 different kinds on a wafer), etc. by probing in a chip (Micro Probing). |
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Transfer section |
The ring clamp method which is not affected by the influence of the sag of a film is used. |
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Quick Loader can reduce the Load/Unload time per sheet to half. (OP)
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Chuck |
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Supports the high temperature range 50 ℃ to 150 ℃ and precise thermal control 25℃±0.3℃. (OP) |
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Noise |
Surface of the chuck: More than－80db (*1) |
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Low Vibration |
High rigidity cabinet made by the iron surface plate and the welding frame |
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Non-magnetic |
Non-magnetic spec is available for a magnetic device. (OP)(*2) |
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Common |
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SPEC |
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Film Frame Size |
2-8-1(φ200mm wafer) Supports 2-6-1 by changing chuck (OP) Supports Eco-ring and square ring (OP) |
2-12(φ300mm wafer) Supports 2-6-1 by changing chuck (OP) Supports Eco-ring and square ring (OP) |
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Probing Area |
Wafer：φ200mm Max: (X)214mm, (Y)214mm (※Contact us for detail) |
Wafer：φ300mm Max: (X) 300mm, (Y) 300mm |
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XY Stage |
Driven by linear motor (Repeat accuracy：1um) |
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Foot Print |
Small space： (W) 1200mm × (D) 860mm |
Small space： (W) 1615mm × (D) 1000mm |
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OTHERS |
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*1 Reference value: 30KHz to 30MHz Loop ANT measurement
*2 Reference value (standard system):Chuck surface: 0.04mT, Transporting rout: 0.2mT
4JMSolutions (Malta) Ltd. was founded in 2008 on a solid base of international servicing and more than 25 years of high end industrial experience. Based on the solid principal of providing solutions where the equipment offered is a biproduct of the solution.
