4jmslogo
Search
Close this search box.

Comparing Wafer Prober Products

Comparing Wafer Prober Products

PRODUCT NAME PCP-102SL PCP-102WS PCP-302N
PRODUCT IMAGE

PRODUCT NAME PCP-102SL PCP-102WS PCP-302N
FEATURES
Development concept
Prober designed for a wafer aiming at Low cost and high throughput
Prober designed to test a double-sided wafer
Prober designed aiming to flexibly satisfy the customers' demands
Image Processing
XY Compensation (PFC original method) and Profiling compensate the position even if a wafer is expanded by the temperature.
XY Compensation (PFC original method) and Profiling compensate the position even for a warped wafer.
XY Compensation (PFC original method) and Profiling compensate the position even if a wafer is expanded by the temperature.

Record of Alignment success for customers' products is 100%. (In Japan)

Probing
Chip probing is executed by Individual Alignment + Wafer Adaptor . (OP)
Accurate RDS(on-resistance) is measured by making Kelvin connection at the drain side on the back of wafer and adjusting its drain-sense-position to the source-sense-position.
Chip probing is executed by Individual Alignment + Wafer Adaptor . (OP)

Capable of Multi-TEG (more than 2 different kinds on a wafer), etc.
by probing in a chip (Micro Probing).

Transfer section

Large diameter Pre-alignment chuck can handle a warped wafer,
thin wafer and TAIKO™ Wafer.(OP)

Quick Loader can reduce the Load/Unload time per sheet to half. (OP)
Quick Loader can reduce the Load/Unload time per sheet to half. (OP)
Quick Loader can reduce the Load/Unload time per sheet to half. (OP)
Chuck
Surface finish for your usage, such as gold plate, nickel plate, etc.
Large current/High voltage probing is supported by the wafer clamp system with the ceramic blade.
Surface finish for your usage, such as gold plate, nickel plate, etc.
Supports the high temperature range 50 ℃ to 150 ℃ and precise thermal control 25℃±0.3℃. (OP)

-

Supports the high temperature range 50 ℃ to 150 ℃ and precise thermal control 25℃±0.3℃. (OP)
Noise

Surface of the chuck: More than-80db (*1)

Low Vibration

High rigidity cabinet made by the iron surface plate and the welding frame

Non-magnetic
Non-magnetic spec is available for a magnetic device. (OP)(*2)

-

Non-magnetic spec is available for a magnetic device. (OP)(*2)
Common
  • Low cost, high throughput
  • Small space (footprint), power-saving design
  • Stable operation (more than MTBF5000 hours)
SPEC
Wafer Size

100mm (4 inch) to 200mm (8 inch)

200mm (8 inch) to 300mm (12 inch)
Probing Area

Wafer:φ200mm

Wafer:φ300mm
XY Stage

Driven by linear motor (Repeat accuracy:1um)

Foot Print

Small space: (W) 1200mm × (D) 860mm

Small space: (W) 1615mm × (D) 1000mm
OTHERS
  • Total: PCP series more than 430 sets (As of April 2018)
  • We can respond to your request flexibly.
  • We can offer special price for the purchase of several sets together.

*1 Reference value: 30KHz to 30MHz Loop ANT measurement
*2 Reference value (standard system):Chuck surface: 0.04mT, Transporting rout: 0.2mT