| PRODUCT NAME | PCP-102SL | PCP-102WS | PCP-302N |
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PRODUCT IMAGE |
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| PRODUCT NAME | PCP-102SL | PCP-102WS | PCP-302N | |
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FEATURES |
Development
concept |
Prober designed for a wafer aiming at Low cost and high throughput |
Prober designed to test a double-sided wafer |
Prober designed aiming to flexibly satisfy the customers' demands |
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Image
Processing |
XY Compensation (PFC original method) and Profiling compensate the position even if a wafer is expanded by the temperature. |
XY Compensation (PFC original method) and Profiling compensate the position even for a warped wafer. |
XY Compensation (PFC original method) and Profiling compensate the position even if a wafer is expanded by the temperature. |
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Record of Alignment success for customers' products is 100%. (In Japan) |
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Probing |
Chip probing is executed by Individual Alignment + Wafer Adaptor . (OP) |
Accurate RDS(on-resistance) is measured by making Kelvin connection at the drain side on the back of wafer and adjusting its drain-sense-position to the source-sense-position. |
Chip probing is executed by Individual Alignment + Wafer Adaptor . (OP) |
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Capable of Multi-TEG (more than 2 different kinds on a wafer), etc. |
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Transfer section |
Large diameter Pre-alignment chuck can handle a warped wafer, |
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Quick Loader can reduce the Load/Unload time per sheet to half. (OP) |
Quick Loader can reduce the Load/Unload time per sheet to half. (OP) |
Quick Loader can reduce the Load/Unload time per sheet to half. (OP) |
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Chuck |
Surface finish for your usage, such as gold plate, nickel plate, etc. |
Large current/High voltage probing is supported by the wafer clamp system with the ceramic blade. |
Surface finish for your usage, such as gold plate, nickel plate, etc. |
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Supports the high temperature range 50 ℃ to 150 ℃ and precise thermal control 25℃±0.3℃. (OP) |
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Supports the high temperature range 50 ℃ to 150 ℃ and precise thermal control 25℃±0.3℃. (OP) |
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Noise |
Surface of the chuck: More than－80db (*1) |
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Low Vibration |
High rigidity cabinet made by the iron surface plate and the welding frame |
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Non-magnetic |
Non-magnetic spec is available for a magnetic device. (OP)(*2) |
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Non-magnetic spec is available for a magnetic device. (OP)(*2) |
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Common |
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SPEC |
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Wafer Size |
100mm (4 inch) to 200mm (8 inch) |
200mm (8 inch)
to
300mm (12 inch) |
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Probing Area |
Wafer：φ200mm |
Wafer：φ300mm |
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XY Stage |
Driven by linear motor (Repeat accuracy：1um) |
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Foot Print |
Small space： (W) 1200mm × (D) 860mm |
Small space：
(W) 1615mm
×
(D) 1000mm |
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OTHERS |
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*1 Reference value: 30KHz to 30MHz Loop ANT measurement
*2 Reference value (standard system):Chuck surface: 0.04mT, Transporting rout: 0.2mT
4JMSolutions (Malta) Ltd. was founded in 2008 on a solid base of international servicing and more than 25 years of high end industrial experience. Based on the solid principal of providing solutions where the equipment offered is a biproduct of the solution.
