Close this search box.




The PCP-102SL is a prober designed for wafer probing, aiming at the low cost and high throughput.

By adopting PFC original XY Compensation and Profiling function, PCP-102SL can compensate the position even for the expansion of wafer caused by the temperature.

  • Effective position compensation even for the wafer’s expansion caused by the temperature.
  • Successful record of Alignment for customers’ products is 100%. (Record only in Japan)
  • Probing more than two points by moving in a chip (Micro Probing)
  • Surface finish for your intended usage, such as gold plate, nickel plate, etc.
  • Low noise: More than -80dB on the chuck
    (Reference Value: 30KHZ to 30MHZ Loop ANT actual measurement)
  • High rigidity cabinet made by the iron surface plate and the welding frame realizes low vibration
  • Low cost and High throughput
  • Small space (Footprint), power-saving design
  • Stable operation (more than MTBF5000 hours)
  • Supports chip probing by the wafer adapter.
  • Large diameter Pre-alignment chuck can handle a warped wafer, thin wafer and TAIKO™ Wafer
  • Quick Loader can reduce the Load/Unload time per sheet by half.
  • Capable of the high temperature range (50 ℃ to 150 ℃) and the precise thermal control (25℃±0.3℃).
  • Non-magnetic spec to handle a magnetic device.
    ※ Reference value (standard system): Chuck surface: 0.04mT
                       Transporting rout: 0.2mT
Wafer size
100mm (4 inch) to 200mm (8 inch)
Probing area
Wafer: φ200mm
XY stage
Driven by linear motor (Repeat accuracy:1um)
Small space: (W)1200mm × (D)860mm
  • Sales achievement: PCP series more than 500 sets (As of April 2022)
  • We can respond to the request from a customer flexibly.
  • We can offer discount for the purchase of several sets together.