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Electronic Flame Off (EFO)

Electronic flame off is used in the wire bonding process where high quality wire bonding is of utmost important. Our microprecision design and manufacture a wide range of EFO wands that is used currently in most wire bonder models in the semiconductor industry. These includes K&S, ASM, Kaijo, Shinkawa etc. Our company seeks high precision machining and use IRIDIUM materials to extend the life of ignition level and to ensure uniformity and stability in the process.

Related Wire Bonding Tools


Wedge is mainly used for aluminium wire / ribbon bonding. We can provide wedges for different aluminium bonding machines. We also can provide scientific selection

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Wire Cutter

We can provide wire cutters and ribbon cutters for different aluminium wire bonding machines. Our cutters are made from special alloy to ensure the robustness

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Capillary Unplugging Wire

Capillary unplugging wire offers an easy economical way to unplug clogged capillary. This is especially useful for engineers during bonding evaluation when the optimum process

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Capillary Cleaning

It is developed for the ultra fine probes that is used in the wafer testing to effectively clean the smallest capillary wire drag holes. We

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